Inventor · disambiguated record
Guido Bönig
Also filed as: BÖNIG GUIDO
1 granted patent·4 pending applications·0 citations·filing 2023–2025
10Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0150US12002740B2Printed circuit board, power semiconductor module arrangement comprising a printed circuit board, and method for assembling the sameINFINEON TECHNOLOGIES AG·Filed 2023·Granted Jun 4, 2024·0 cites·15 claims
- 0250US2024266260A1Method for forming a terminal element, terminal element, and power semiconductor module arrangement having a terminal elementINFINEONTECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0344US2023253291A1Power semiconductor module arrangement and methods for producing a semiconductor arrangementINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 0444US2024071853A1Power Semiconductor Module Comprising a First and a Second Compartment and Method for Fabricating the SameINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 0539US2025253220A1Power semiconductor module arrangementINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →