Inventor · disambiguated record
Gunho Chang
Also filed as: CHANG GUNHO
2 granted patents·11 pending applications·9 citations·filing 2020–2025
55Inventor score
Top patents by PatentIndex Score
13 records- 0193US11393764B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 19, 2022·7 cites·20 claims
- 0289US11848274B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 19, 2023·2 cites·20 claims
- 0356US2025349637A1Semiconductor package including fillet structureSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0455US2024297150A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0552US2025118709A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0652US2024290754A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0750US2024304599A1Semiconductor package and a method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0848US2024081161A13-dimensional memristor element and method for manufacturing the sameKOREA ADVANCED INST SCI & TECH·Filed 2022·Application pending·0 cites
- 0948US2024055413A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1048US2024071951A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1148US2023352429A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1246US2022246582A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Application pending·0 cites
- 1340US2025372471A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →