Inventor · disambiguated record
Guo Qing Chen
Also filed as: CHEN GUO QING
10 granted patents·2 pending applications·27 citations·filing 2008–2021
85Inventor score
Files withSEMICONDUCTOR MFG INT SHANGHAI4SEMICONDUCTOR MFG INT SHANGHAI CORP4XIAO DE YUAN3XIAO DEYUAN1
Top patents by PatentIndex Score
12 records- 0188US8884363B2System and method for integrated circuits with cylindrical gate structuresXIAO DE YUAN·Filed 2010·Granted Nov 11, 2014·12 cites·21 claims
- 0277US9202762B2Hybrid integrated semiconductor tri-gate and split dual-gate FinFET devices and method for manufacturingXIAO DEYUAN·Filed 2011·Granted Dec 1, 2015·5 cites·18 claims
- 0376US9224812B2System and method for integrated circuits with cylindrical gate structuresSEMICONDUCTOR MFG INT SHANGHAI·Filed 2014·Granted Dec 29, 2015·3 cites·24 claims
- 0474US10923399B2Hybrid integrated semiconductor tri-gate and split dual-gate FinFET devices and method for manufacturingSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2018·Granted Feb 16, 2021·1 cites·20 claims
- 0573US8293635B2Method and system for forming conductive bumping with copper interconnectionXIAO DE YUAN·Filed 2011·Granted Oct 23, 2012·3 cites·12 claims
- 0665US2021134675A1Hybrid integrated semiconductor tri-gate and split dual-gate finfet devicesSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2021·Application pending·0 cites
- 0764US9373694B2System and method for integrated circuits with cylindrical gate structuresSEMICONDUCTOR MFG INT SHANGHAI·Filed 2013·Granted Jun 21, 2016·1 cites·11 claims
- 0864US8053907B2Method and system for forming conductive bumping with copper interconnectionSEMICONDUCTOR MFG INT SHANGHAI·Filed 2008·Granted Nov 8, 2011·2 cites·10 claims
- 0953US9922878B2Hybrid integrated semiconductor tri-gate and split dual-gate FinFET devices and method for manufacturingSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2012·Granted Mar 20, 2018·0 cites·20 claims
- 1051US9673060B2System and method for integrated circuits with cylindrical gate structuresSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2016·Granted Jun 6, 2017·0 cites·10 claims
- 1150US8581366B2Method and system for forming conductive bumping with copper interconnectionXIAO DE YUAN·Filed 2012·Granted Nov 12, 2013·0 cites·11 claims
- 1233US2011108889A1Semiconductor device with a 7f2 cell structureSEMICONDUCTOR MFG INT SHANGHAI·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →