Inventor · disambiguated record
Günter Denifl
Also filed as: DENIFL GÜNTER
4 granted patents·1 pending application·3 citations·filing 2014–2025
63Inventor score
Top patents by PatentIndex Score
5 records- 0187US11887894B2Methods for processing a wide band gap semiconductor wafer using a support layer and methods for forming a plurality of thin wide band gap semiconductor wafers using support layersINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jan 30, 2024·1 cites·21 claims
- 0284US2025380466A1Semiconductor device having a field plate electrode with an embedded strain-inducing materialINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2025·Application pending·0 cites
- 0381US11728427B2Power semiconductor device having a strain-inducing material embedded in an electrodeINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Aug 15, 2023·1 cites·30 claims
- 0473US12471324B2Power semiconductor device having an electrode with an embedded materialINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Granted Nov 11, 2025·0 cites·13 claims
- 0564US10081533B2Micromechanical structure and method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2014·Granted Sep 25, 2018·1 cites·39 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →