Inventor · disambiguated record
Guy F. Hudson
Also filed as: HUDSON GUY · HUDSON GUY F · ZAHORIK LEGAL REPRESENTATIVE R
46 granted patents·2,199 citations·filing 1992–2007
99Inventor score
Top patents by PatentIndex Score
46 records- 0196US6200901B1Polishing polymer surfaces on non-porous CMP padsMICRON TECHNOLOGY INC·Filed 1998·Granted Mar 13, 2001·177 cites·42 claims
- 0296US5972792AMethod for chemical-mechanical planarization of a substrate on a fixed-abrasive polishing padMICRON TECHNOLOGY INC·Filed 1996·Granted Oct 26, 1999·267 cites·38 claims
- 0395US6368194B1Apparatus for controlling PH during planarization and cleaning of microelectronic substratesMICRON TECHNOLOGY INC·Filed 2000·Granted Apr 9, 2002·135 cites·17 claims
- 0495US6103636AMethod and apparatus for selective removal of material from wafer alignment marksMICRON TECHNOLOGY INC·Filed 1997·Granted Aug 15, 2000·122 cites·64 claims
- 0594US5830806AWafer backing member for mechanical and chemical-mechanical planarization of substratesMICRON TECHNOLOGY INC·Filed 1996·Granted Nov 3, 1998·157 cites·50 claims
- 0693US5976000APolishing pad with incompressible, highly soluble particles for chemical-mechanical planarization of semiconductor wafersMICRON TECHNOLOGY INC·Filed 1999·Granted Nov 2, 1999·144 cites·12 claims
- 0792US6057602ALow friction polish-stop stratum for endpointing chemical-mechanical planarization processing of semiconductor wafersMICRON TECHNOLOGY INC·Filed 1998·Granted May 2, 2000·98 cites·21 claims
- 0891US6220934B1Method for controlling pH during planarization and cleaning of microelectronic substratesMICRON TECHNOLOGY INC·Filed 1998·Granted Apr 24, 2001·100 cites·27 claims
- 0991US5679169AMethod for post chemical-mechanical planarization cleaning of semiconductor wafersMICRON TECHNOLOGY INC·Filed 1995·Granted Oct 21, 1997·100 cites·23 claims
- 1089US5894852AMethod for post chemical-mechanical planarization cleaning of semiconductor wafersMICRON TECHNOLOGY INC·Filed 1997·Granted Apr 20, 1999·85 cites·23 claims
- 1189US5849091AMegasonic cleaning methods and apparatusMICRON TECHNOLOGY INC·Filed 1997·Granted Dec 15, 1998·78 cites·20 claims
- 1288US6329301B1Method and apparatus for selective removal of material from wafer alignment marksMICRON TECHNOLOGY INC·Filed 2000·Granted Dec 11, 2001·25 cites·64 claims
- 1388US5798302ALow friction polish-stop stratum for endpointing chemical-mechanical planarization processing of semiconductor wafersMICRON TECHNOLOGY INC·Filed 1996·Granted Aug 25, 1998·75 cites·15 claims
- 1488US5650619AQuality control method for detecting defective polishing pads used in chemical-mechanical planarization of semiconductor wafersMICRON TECHNOLOGY INC·Filed 1995·Granted Jul 22, 1997·71 cites·11 claims
- 1587US7214125B2Method for controlling pH during planarization and cleaning of microelectronic substratesMICRON TECHNOLOGY INC·Filed 2005·Granted May 8, 2007·9 cites·16 claims
- 1687US5698455AMethod for predicting process characteristics of polyurethane padsMICRON TECHNOLOGIES INC·Filed 1995·Granted Dec 16, 1997·54 cites·30 claims
- 1784US6447634B1Method and apparatus for selective removal of material from wafer alignment marksMICRON TECHNOLOGY INC·Filed 2000·Granted Sep 10, 2002·23 cites·31 claims
- 1884US6407000B1Method and apparatuses for making and using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assembliesMICRON TECHNOLOGY INC·Filed 1999·Granted Jun 18, 2002·35 cites·87 claims
- 1982US6273101B1Method for post chemical-mechanical planarization cleaning of semiconductor wafersMICRON TECHNOLOGY INC·Filed 1999·Granted Aug 14, 2001·53 cites·7 claims
- 2081US6114706AMethod and apparatus for predicting process characteristics of polyurethane padsMICRON TECHNOLOGY INC·Filed 1997·Granted Sep 5, 2000·46 cites·11 claims
- 2181US6006765AMegasonic cleaning methods and apparatusMICRON TECHNOLOGY INC·Filed 1998·Granted Dec 28, 1999·47 cites·12 claims
- 2280US5956612ATrench/hole fill processes for semiconductor fabricationMICRON TECHNOLOGY INC·Filed 1996·Granted Sep 21, 1999·58 cites·80 claims
- 2379US6610610B2Methods for selective removal of material from wafer alignment marksMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 26, 2003·13 cites·64 claims
- 2479US6048405AMegasonic cleaning methods and apparatusMICRON TECHNOLOGY INC·Filed 1998·Granted Apr 11, 2000·43 cites·28 claims
- 2577US5297755ATape cartridge tape pathIBM·Filed 1992·Granted Mar 29, 1994·29 cites·18 claims
- 2675US6794289B2Method and apparatuses for making and using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assembliesMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 21, 2004·12 cites·4 claims
- 2772US6640816B2Method for post chemical-mechanical planarization cleaning of semiconductor wafersMICRON TECHNOLOGY INC·Filed 2001·Granted Nov 4, 2003·14 cites·22 claims
- 2872US6530113B2Apparatus for selective removal of material from wafer alignment marksMICRON TECHNOLOGY INC·Filed 2002·Granted Mar 11, 2003·8 cites·31 claims
- 2971US6062952APlanarization process with abrasive polishing slurry that is selective to a planarized surfaceFiled 1997·Granted May 16, 2000·34 cites·41 claims
- 3066US7122475B2Methods for using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assembliesMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 17, 2006·6 cites·32 claims
- 3162US5838445AMethod and apparatus for determining surface roughnessMICRON TECHNOLOGY INC·Filed 1997·Granted Nov 17, 1998·23 cites·20 claims
- 3261US6716089B2Method for controlling pH during planarization and cleaning of microelectronic substratesMICRON TECHNOLOGY INC·Filed 2001·Granted Apr 6, 2004·5 cites·42 claims
- 3359US6379225B1Planarization process with abrasive polishing slurry that is selective to a planarized surfaceMICRON TECHNOLOGY INC·Filed 2000·Granted Apr 30, 2002·5 cites·41 claims
- 3458US8053371B2Apparatus and methods for selective removal of material from wafer alignment marksMICRON TECHNOLOGY INC·Filed 2007·Granted Nov 8, 2011·0 cites·18 claims
- 3558US7244681B2Methods for selective removal of material from wafer alignment marksMICRON TECHNOLOGY INC·Filed 2003·Granted Jul 17, 2007·3 cites·19 claims
- 3658US7045017B2Method for post chemical-mechanical planarization cleaning of semiconductor wafersMICRON TECHNOLOGY INC·Filed 2003·Granted May 16, 2006·5 cites·15 claims
- 3758US6913523B2Method for controlling pH during planarization and cleaning of microelectronic substratesMICRON TECHNOLOGY INC·Filed 2004·Granted Jul 5, 2005·4 cites·16 claims
- 3858US6889698B2Apparatus for selective removal of material from wafer alignment marksMICRON TECHNOLOGY INC·Filed 2003·Granted May 10, 2005·3 cites·17 claims
- 3958US5825028AQuality control method for detecting defective polishing pads used in planarization of semiconductor wafersMICRON TECHNOLOGY INC·Filed 1997·Granted Oct 20, 1998·16 cites·36 claims
- 4052US6803316B2Method of planarizing by removing all or part of an oxidizable material layer from a semiconductor substrateMICRON TECHNOLOGY INC·Filed 2003·Granted Oct 12, 2004·2 cites·9 claims
- 4152US6635574B2Method of removing material from a semiconductor substrateMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 21, 2003·2 cites·11 claims
- 4249US7294570B2Contact integration methodMICRON TECHNOLOGY INC·Filed 2004·Granted Nov 13, 2007·2 cites·17 claims
- 4349US6440319B1Method and apparatus for predicting process characteristics of polyurethane padsMICRON TECHNOLOGY INC·Filed 2000·Granted Aug 27, 2002·2 cites·1 claims
- 4443USRE39413ELow friction polish-stop stratum for endpointing chemical-mechanical planarization processing of semiconductor wafersMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 28, 2006·0 cites·21 claims
- 4541US6593657B1Contact integration articleMICRON TECHNOLOGY INC·Filed 1997·Granted Jul 15, 2003·7 cites·9 claims
- 4633US6713384B1Contact integration methodMICRON TECHNOLOGY INC·Filed 1998·Granted Mar 30, 2004·2 cites·26 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →