Inventor · disambiguated record

Gun-Ig Jeung

Also filed as: JEUNG GUN-IG

1 granted patent·1 pending application·11 citations·filing 2004–2012

34Inventor score

Technology areasH10P

Files withJEUNG GUN-IG1 SAMSUNG ELECTRONICS CO LTD1

Top patents by PatentIndex Score

2 records

0154US7160181B2Polishing pad of CMP equipment for polishing a semiconductor waferSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jan 9, 2007·11 cites·6 claims
0225US2012247508A1Brush and method for cleaning a substrate and scrubber employing the sameJEUNG GUN-IG·Filed 2012·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →