Inventor · disambiguated record
Gunhyuck Lee
Also filed as: LEE GUNHYUCK
6 granted patents·4 pending applications·2 citations·filing 2021–2025
69Inventor score
Files withSTATS CHIPPAC PTE LTD10
Top patents by PatentIndex Score
10 records- 0186US11869848B2Semiconductor device and method of stacking devices using support frameSTATS CHIPPAC PTE LTD·Filed 2021·Granted Jan 9, 2024·2 cites·20 claims
- 0272US2025357286A1Semiconductor Device and Method of Disposing Electrical Components Over Side Surfaces of Interconnect SubstrateSTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
- 0370US12288754B2Semiconductor device and method of stacking devices using support frameSTATS CHIPPAC PTE LTD·Filed 2023·Granted Apr 29, 2025·0 cites·21 claims
- 0467US2025273595A1Semiconductor Device and Method for Selective EMI Shielding Using a MaskSTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
- 0565US12327800B2Semiconductor device and method for selective EMI shielding using a maskSTATS CHIPPAC PTE LTD·Filed 2022·Granted Jun 10, 2025·0 cites·25 claims
- 0664US12400941B2Semiconductor device and method of disposing electrical components over side surfaces of interconnect substrateSTATS CHIPPAC PTE LTD·Filed 2022·Granted Aug 26, 2025·0 cites·32 claims
- 0762US12456689B2Interconnect device and semiconductor assembly incorporating the sameSTATS CHIPPAC PTE LTD·Filed 2023·Granted Oct 28, 2025·0 cites·15 claims
- 0851US2023378088A1Apparatus and method for selectively forming a shielding layer on a semiconductor packageSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 0951US2023386888A1Methods for making semiconductor devicesSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 1050US12176335B2Semiconductor device and method using tape attachmentSTATS CHIPPAC PTE LTD·Filed 2022·Granted Dec 24, 2024·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →