Inventor · disambiguated record
Guangxu Li
Also filed as: LI GUANGXU
10 granted patents·12 pending applications·4 citations·filing 2017–2025
79Inventor score
Top patents by PatentIndex Score
22 records- 0189US11784113B2Multilayer package substrate with stress bufferTEXAS INSTRUMENTS INC·Filed 2021·Granted Oct 10, 2023·2 cites·20 claims
- 0281US12278205B2Semiconductor device package with improved die pad and solder mask designTEXAS INSTRUMENTS INC·Filed 2020·Granted Apr 15, 2025·2 cites·25 claims
- 0373US12438072B2Multilayer package substrate with stress bufferTEXAS INSTRUMENTS INC·Filed 2023·Granted Oct 7, 2025·0 cites·24 claims
- 0471US2025323178A1Package substrate with cte matching barrier ring around microviasTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 0569US12243835B2Package substrate with CTE matching barrier ring around microviasTEXAS INSTRUMENTS INC·Filed 2022·Granted Mar 4, 2025·0 cites·19 claims
- 0659US2025167125A1Build-up film and pre-preg substrates in isolation packagesTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0758US2025233036A1Integrated circuit with a protective layerTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0857US2025105104A1Quad flat no-lead package with enhanced corner pads for board level reliabilityTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 0957US2025246492A1Ic package with interconnectTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1056US2023411262A1Microelectronics device package and methodsTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1155US11270955B2Package substrate with CTE matching barrier ring around microviasTEXAS INSTRUMENTS INC·Filed 2018·Granted Mar 8, 2022·0 cites·34 claims
- 1254US12381139B2Electronic device and multilevel package substrate with elevated trace features for solder and/or die confinement and method for fabricating the electronic deviceTEXAS INSTRUMENTS INC·Filed 2022·Granted Aug 5, 2025·0 cites·20 claims
- 1354US2025239507A1Ic package with die and copper postsTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1452US2025006661A1Multilevel package substrate for interlevel dielectric crack mitigationTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1549US2025279336A1Microelectronic device package with multilayer package substrateTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1647US11912919B2Core-shell quantum dot, preparation method thereof, and electroluminescent light-emitting device containing the sameNAJING TECH CORP LTD·Filed 2018·Granted Feb 27, 2024·0 cites·15 claims
- 1747US2023378146A1Microelectronic device package with integral passive componentTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1847US2023295488A1Nanocrystalline preparation method, nanocrystalline, and optical film and light emitting device containing sameNAJING TECH CORP LTD·Filed 2021·Application pending·0 cites
- 1944US12260201B2Application deployment method, application blueprint generation method, platform, terminal and mediumZTE CORP·Filed 2021·Granted Mar 25, 2025·0 cites·20 claims
- 2043US10748863B2Semiconductor devices having metal posts for stress relief at flatness discontinuitiesTEXAS INSTRUMENTS INC·Filed 2017·Granted Aug 18, 2020·0 cites·21 claims
- 2140US2022403240A1Quantum dot and preparation methods for the same, and photoelectric deviceNAJING TECH CORP LTD·Filed 2020·Application pending·0 cites
- 2237US11522481B2Memory motor winding multiplexing control method and system for flux linkage observationUNIV SOUTHEAST·Filed 2019·Granted Dec 6, 2022·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →