Inventor · disambiguated record
Guo Feng Lian
Also filed as: LIAN GUO FENG
3 granted patents·0 citations·filing 2012–2015
37Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0138US9245861B2Wafer process for molded chip scale package (MCSP) with thick backside metallizationALPHA & OMEGA SEMICONDUCTOR·Filed 2014·Granted Jan 26, 2016·0 cites·13 claims
- 0233US9520380B2Wafer process for molded chip scale package (MCSP) with thick backside metallizationALPHA & OMEGA SEMICONDUCTOR·Filed 2015·Granted Dec 13, 2016·0 cites·13 claims
- 0333US8703545B2Aluminum alloy lead-frame and its use in fabrication of power semiconductor packageNIU ZHIQIANG·Filed 2012·Granted Apr 22, 2014·0 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →