Inventor · disambiguated record
Guo Liu
Also filed as: LIU GUO · LIU GUO LIN
8 granted patents·9 pending applications·57 citations·filing 1998–2025
81Inventor score
Files withUNIV CITY HONG KONG8OKI ELECTRIC IND CO LTD4CITY UNIV OF HONG KONG SHENZHEN FUTIAN RESEARCH INSTITUTE2CITY UNIV OF HONG KONG MATTER SCIENCE RESEARCH INSTITUTE FUTIAN1LIU GUO1
Top patents by PatentIndex Score
17 records- 0177US10377076B2System and method for four-dimensional printing of ceramic origami structuresUNIV CITY HONG KONG·Filed 2017·Granted Aug 13, 2019·1 cites·18 claims
- 0276US2024092013A1In- situ 4d printing of high-temperature materialsUNIV CITY HONG KONG·Filed 2023·Application pending·0 cites
- 0374US6037588AMethod for testing semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 1998·Granted Mar 14, 2000·46 cites·20 claims
- 0473US11858200B2In-situ 4D printing of high-temperature materialsUNIV CITY HONG KONG·Filed 2021·Granted Jan 2, 2024·0 cites·14 claims
- 0573US2025092945A1Method for manufacturing high-temperature structural material and precursorCITY UNIV OF HONG KONG MATTER SCIENCE RESEARCH INSTITUTE FUTIAN·Filed 2024·Application pending·0 cites
- 0671US2023135069A1Method for manufacturing high-temperature structural material and precursorUNIV OF HONG KONG SHENZHEN FUTIAN RESEARCH INSTITUTE·Filed 2022·Application pending·0 cites
- 0767US2025136518A1Shape memory ceramics and manufacturing and 4d printing methods thereofUNIV CITY HONG KONG·Filed 2024·Application pending·0 cites
- 0866US2025187986A13d/4d additive-subtractive manufacturing of ceramic/glass components in 3c productsUNIV CITY HONG KONG·Filed 2024·Application pending·0 cites
- 0963US2025262796A1Ceramic component, ceramic/metal component, manufacturing method therefor and applications thereofCITY UNIV OF HONG KONG SHENZHEN FUTIAN RESEARCH INSTITUTE·Filed 2025·Application pending·0 cites
- 1061US11104030B2Method for constructing a printed ceramic object and a ceramic object constructed by the sameUNIV CITY HONG KONG·Filed 2018·Granted Aug 31, 2021·0 cites·20 claims
- 1159US2024269885A1Ceramic Component, Ceramic/metal Component, Manufacturing Method Therefor and Applications ThereofCITY UNIV OF HONG KONG SHENZHEN FUTIAN RESEARCH INSTITUTE·Filed 2023·Application pending·0 cites
- 1257US11065781B2System and method for four-dimensional printing of elastomer-derived ceramic structures by self-forming methodUNIV CITY HONG KONG·Filed 2018·Granted Jul 20, 2021·0 cites·14 claims
- 1354US11000991B2Systems and method for four-dimensional printing of elastomer-derived ceramic structures by compressive buckling-induced methodUNIV CITY HONG KONG·Filed 2018·Granted May 11, 2021·0 cites·17 claims
- 1454US7190040B2Semiconductor device and method of manufacturing sameOKI ELECTRIC IND CO LTD·Filed 2004·Granted Mar 13, 2007·5 cites·6 claims
- 1550US7071076B2Method of manufacturing semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2004·Granted Jul 4, 2006·5 cites·10 claims
- 1644US2008248644A1Method of fabricating a semiconductor device with a porous dielectric filmOKI ELECTRIC IND CO LTD·Filed 2008·Application pending·0 cites
- 1741US2011311726A1Method and apparatus for precursor deliveryLIU GUO·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →