Inventor · disambiguated record
Guandong Liu
Also filed as: LIU GUANDONG
2 granted patents·1 citations·filing 2023–2023
28Inventor score
Technology areasH10W
Files withZhejiang Lab2
Top patents by PatentIndex Score
2 records- 0185US11776879B1Three-dimensional stacked package structure with micro-channel heat dissipation structure and packaging method thereofZhejiang Lab·Filed 2023·Granted Oct 3, 2023·1 cites·1 claims
- 0252US11876071B1System-on-wafer structure and fabrication methodZhejiang Lab·Filed 2023·Granted Jan 16, 2024·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →