Inventor · disambiguated record
Guan-Lin Pan
Also filed as: PAN GUAN-LIN
2 granted patents·3 pending applications·3 citations·filing 2021–2024
38Inventor score
Files withORIENT SEMICONDUCTOR ELECTRONICS LTD5
Top patents by PatentIndex Score
5 records- 0185US11355356B1Manufacturing method of semiconductor package comprising heat spreaderORIENT SEMICONDUCTOR ELECTRONICS LTD·Filed 2021·Granted Jun 7, 2022·3 cites·4 claims
- 0256US2025125216A1Die and manufacturing method thereof as well as semiconductor package with the sameORIENT SEMICONDUCTOR ELECTRONICS LTD·Filed 2024·Application pending·0 cites
- 0353US2025062281A1Semiconductor package and manufacturing method thereofORIENT SEMICONDUCTOR ELECTRONICS LTD·Filed 2024·Application pending·0 cites
- 0446US11462454B2Semiconductor package comprising heat spreader and manufacturing method thereofORIENT SEMICONDUCTOR ELECTRONICS LTD·Filed 2021·Granted Oct 4, 2022·0 cites·6 claims
- 0539US2022285217A1Wafer thinning methodORIENT SEMICONDUCTOR ELECTRONICS LTD·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →