Inventor · disambiguated record
Gunther Rauscher
Also filed as: RAUSCHER GUNTHER
1 granted patent·1 pending application·5 citations·filing 2005–2007
26Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0156US7053489B2Arrangement with a semiconductor chip and support therefore and method for a bonded wire connectionSIEMENS AG·Filed 2005·Granted May 30, 2006·5 cites·6 claims
- 0227US2007235732A1Electrical arrangement comprising a wire connection arrangement and method for the production of such an electrical arrangementGOHLKE SILVIA·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →