Inventor · disambiguated record
Gunter Schwab
Also filed as: SCHWAB GUENTER · SCHWAB GUNTER · SCHWAB GÜNTER · STADLER MAX DIPL CHEM DR
10 granted patents·4 pending applications·165 citations·filing 1976–2023
90Inventor score
Files withSILTRONIC AG4MASCHF AUGSBURG NUERNBERG AG2WACKER SILTRONIC HALBLEITERMAT2SCHIENLE FRANK1SCHWAB GUNTER1
Top patents by PatentIndex Score
14 records- 0179US4837413ARotary switchSTANDARD ELEKTRIK LORENZ AG·Filed 1987·Granted Jun 6, 1989·34 cites·19 claims
- 0279US4102600AMoving blade ring of high circumferential speed for thermal axially passed through turbinesMASCHF AUGSBURG NUERNBERG AG·Filed 1976·Granted Jul 25, 1978·30 cites·2 claims
- 0367US7829467B2Method for producing a polished semiconductorSILTRONIC AG·Filed 2007·Granted Nov 9, 2010·3 cites·16 claims
- 0465US4080102AMoving blade row of high peripheral speed for thermal axial-flow turbo machinesMASCHF AUGSBURG NUERNBERG AG·Filed 1976·Granted Mar 21, 1978·32 cites·10 claims
- 0564US6610213B1Process for the wet chemical treatment of a semiconductor waferWACKER SILTRONIC HALBLEITERMAT·Filed 2000·Granted Aug 26, 2003·11 cites·13 claims
- 0660US7083741B2Process and device for the wet-chemical treatment of siliconSILTRONIC AG·Filed 2003·Granted Aug 1, 2006·8 cites·6 claims
- 0757US6530381B1Process for the wet-chemical surface treatment of a semiconductor waferWACKER SILTRONIC HALBLEITERMAT·Filed 2000·Granted Mar 11, 2003·9 cites·3 claims
- 0853US5451267AProcess for the wet-chemical treatment of disk-shaped workpiecesWACKER CHEMITRONIC·Filed 1994·Granted Sep 19, 1995·27 cites·9 claims
- 0948US2025385105A1Cover for a cleaning module for cleaning a semiconductor wafer, and method for cleaning a semiconductor wafer in a cleaning lineSILTRONIC AG·Filed 2023·Application pending·0 cites
- 1039US6767841B2Process for producing a semiconductor waferSILTRONIC AG·Filed 2001·Granted Jul 27, 2004·1 cites·7 claims
- 1134US5587046AProcess for treating semiconductor material with an acid-containing fluidWACKER SILTRONIC GES FUER·Filed 1995·Granted Dec 24, 1996·10 cites·10 claims
- 1232US2004266191A1Process for the wet-chemical surface treatment of a semiconductor waferSCHWAB GUNTER·Filed 2004·Application pending·0 cites
- 1332US2004222416A1Polished semiconductor wafer and process for producing itFiled 2004·Application pending·0 cites
- 1426US2012248068A1Process Module for the Inline-Treatment of SubstratesSCHIENLE FRANK·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →