Inventor · disambiguated record
Guan Choon Matthew Nelson Tee
Also filed as: TEE GUAN CHOON · TEE GUAN CHOON MATTHEW NELSON
4 granted patents·1 pending application·16 citations·filing 2007–2023
71Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0184US10396007B2Semiconductor package with plateable encapsulant and a method for manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2017·Granted Aug 27, 2019·4 cites·13 claims
- 0281US11081455B2Semiconductor device with bond pad extensions formed on molded appendageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Aug 3, 2021·4 cites·14 claims
- 0371US11081417B2Manufacturing a package using plateable encapsulantINFINEON TECHNOLOGIES AG·Filed 2019·Granted Aug 3, 2021·1 cites·17 claims
- 0462US8116102B2Integrated circuit device and method of producingWONG CHEE PENG·Filed 2007·Granted Feb 14, 2012·7 cites·19 claims
- 0554US2024162136A1Package for a lateral power transistorINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →