Inventor · disambiguated record
Guat Kew Teh
Also filed as: TEH GUAT KEW
2 granted patents·4 citations·filing 2010–2014
45Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0155US8519519B2Semiconductor device having die pads isolated from interconnect portion and method of assembling sameLEE BENG SIONG·Filed 2010·Granted Aug 27, 2013·3 cites·9 claims
- 0246US9595505B2Thermally-enhanced three dimensional system-in-packages and methods for the fabrication thereofCHEN SHOUHUI·Filed 2014·Granted Mar 14, 2017·1 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →