Inventor · disambiguated record
Guoliang Xie
Also filed as: XIE GUOLIANG
6 granted patents·5 pending applications·3 citations·filing 2015–2019
68Inventor score
Top patents by PatentIndex Score
11 records- 0170US10541186B2Chip package and chip packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2018·Granted Jan 21, 2020·2 cites·13 claims
- 0261US10325946B2Packaging method and package structure for image sensing chipCHINA WAFER LEVEL CSP CO LTD·Filed 2016·Granted Jun 18, 2019·1 cites·15 claims
- 0347US10817700B2Optical fingerprint recognition chip package and packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2018·Granted Oct 27, 2020·0 cites·20 claims
- 0445US10994005B2Method for preparing a K serum with a vibrio parahaemolyticus as an antigenUNIV ZHEJIANG·Filed 2019·Granted May 4, 2021·0 cites·2 claims
- 0538US10283483B2Packaging method and package structure for image sensing chipCHINA WAFER LEVEL CSP CO LTD·Filed 2016·Granted May 7, 2019·0 cites·15 claims
- 0634US10541262B2Image sensing chip packaging structure and packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2016·Granted Jan 21, 2020·0 cites·12 claims
- 0733US2019067352A1Photosensitive chip packaging structure and packaging method thereofCHINA WAFER LEVEL CSP CO LTD·Filed 2016·Application pending·0 cites
- 0833US2019013302A1Packaging method and package structure for fingerprint recognition chip and drive chipCHINA WAFER LEVEL CSP CO LTD·Filed 2018·Application pending·0 cites
- 0932US2019296064A1Packaging method and packaging structure for semiconductor chipCHINA WAFER LEVEL CSP CO LTD·Filed 2017·Application pending·0 cites
- 1032US2018301488A1Image sensing chip packaging structure and packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2015·Application pending·0 cites
- 1132US2020395399A1Packaging method and packaging structure for semiconductor chipCHINA WAFER LEVEL CSP CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →