Inventor · disambiguated record
Guoliang Ye
Also filed as: YE GUOLIANG
9 granted patents·8 pending applications·16 citations·filing 2016–2025
80Inventor score
Files withWUHAN XINXIN SEMICONDUCTOR MFG14YE GUOLIANG2WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD1
Top patents by PatentIndex Score
17 records- 0174USD1002302SBottle holderYE GUOLIANG·Filed 2023·Granted Oct 24, 2023·6 cites·1 claims
- 0274US10930619B2Multi-wafer bonding structure and bonding methodWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2019·Granted Feb 23, 2021·3 cites·20 claims
- 0372USD929737SStorage containerYE GUOLIANG·Filed 2020·Granted Sep 7, 2021·7 cites·1 claims
- 0466US12243905B2Method of forming metal grid, backside-illuminated image sensor and method of forming the sameWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2021·Granted Mar 4, 2025·0 cites·14 claims
- 0564US2025151422A1Backside-illuminated image sensorWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2025·Application pending·0 cites
- 0657US2024332079A1Dicing method, bonding method and dieWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2023·Application pending·0 cites
- 0755US2025069966A1C2w structure and method for making sameWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2023·Application pending·0 cites
- 0853US2024234476A9Image sensor structure and method of fabricating the sameWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2022·Application pending·0 cites
- 0951US2024105532A1Chip packaging method and chip packaging structureWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2022·Application pending·0 cites
- 1047US12368110B2Wafer assembly having alignment marks, method for forming same, and wafer alignment methodWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2020·Granted Jul 22, 2025·0 cites·20 claims
- 1144US12506095B2Wafer bonding structure, wafer bonding method and chip bonding structureWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2020·Granted Dec 23, 2025·0 cites·16 claims
- 1243US10203563B2Forming methods of liquid crystal layers, liquid crystal panels, and liquid crystal dripping devicesWUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD·Filed 2016·Granted Feb 12, 2019·0 cites·11 claims
- 1343US2024006454A1Backside illuminated image sensor substrate and method for manufacturing backside illuminated image sensorWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2020·Application pending·0 cites
- 1440US11164840B2Chip interconnection structure, wafer interconnection structure and method for manufacturing the sameWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2019·Granted Nov 2, 2021·0 cites·15 claims
- 1537US2023402415A1Method for manufacturing semiconductor device, and semiconductor deviceWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2020·Application pending·0 cites
- 1636US2020075482A1Semiconductor device and manufacturing method thereofWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2019·Application pending·0 cites
- 1735US11164834B2Wafer structure and method for manufacturing the same, and chip structureWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2019·Granted Nov 2, 2021·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →