Inventor · disambiguated record
Guoqing Yu
Also filed as: YU GUOQING
17 granted patents·8 pending applications·103 citations·filing 2006–2024
90Inventor score
Files withCHINA WAFER LEVEL CSP LTD8TONGFU MICROELECTRONICS CO LTD5AVANTGARDE SHANGHAI ENVIRONMENTAL TECH CO LTD3SHAO MINGDA2WANG ZHIQI2
Top patents by PatentIndex Score
25 records- 0193US7394152B2Wafer level chip size packaged chip device with an N-shape junction inside and method of fabricating the sameCHINA WAFER LEVEL CSP LTD·Filed 2006·Granted Jul 1, 2008·47 cites·5 claims
- 0291US7781250B2Wafer level chip size package for MEMS devices and method for fabricating the sameCHINA WAFER LEVEL CSP LTD·Filed 2008·Granted Aug 24, 2010·27 cites·10 claims
- 0387US7663213B2Wafer level chip size packaged chip device with a double-layer lead structure and method of fabricating the sameCHINA WAFER LEVEL CSP LTD·Filed 2006·Granted Feb 16, 2010·20 cites·7 claims
- 0470US8445919B2Wafer-level package structure of light emitting diode and manufacturing method thereofLI JUNJIE·Filed 2010·Granted May 21, 2013·3 cites·16 claims
- 0564US7795074B2WLCSP target and method for forming the sameCHINA WAFER LEVEL CSP LTD·Filed 2009·Granted Sep 14, 2010·4 cites·26 claims
- 0660US2025336874A1Sintering for semiconductor device assembliesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 0759US11948960B2Semiconductor packaging method and semiconductor package deviceTONGFU MICROELECTRONICS CO LTD·Filed 2021·Granted Apr 2, 2024·0 cites·20 claims
- 0855US8174090B2Packaging structureWANG ZHIQI·Filed 2009·Granted May 8, 2012·2 cites·8 claims
- 0955US2024128141A1Multi-chip packaging method and multi-chip packaging structureLUXIS PREC INTELLIGENT MANUFACTURING KUNSHAN CO LTD·Filed 2023·Application pending·0 cites
- 1054US11948911B2Semiconductor packaging method and semiconductor package deviceTONGFU MICROELECTRONICS CO LTD·Filed 2021·Granted Apr 2, 2024·0 cites·17 claims
- 1154US2016128933A1Therapeutic Methods and CompositionsSHANG TIANGANG·Filed 2014·Application pending·0 cites
- 1253US12074183B2Semiconductor packaging method and semiconductor package deviceTONGFU MICROELECTRONICS CO LTD·Filed 2021·Granted Aug 27, 2024·0 cites·20 claims
- 1353US11990432B2Semiconductor packaging method and semiconductor package deviceTONGFU MICROELECTRONICS CO LTD·Filed 2021·Granted May 21, 2024·0 cites·10 claims
- 1453US11926709B2Method for recycling waste polyesterAVANTGARDE SHANGHAI ENVIRONMENTAL TECH CO LTD·Filed 2020·Granted Mar 12, 2024·0 cites·11 claims
- 1553US11572452B2Method for recycling continuous alcoholysis of waste polyester materialAVANTGARDE SHANGHAI ENVIRONMENTAL TECH CO LTD·Filed 2020·Granted Feb 7, 2023·0 cites·16 claims
- 1651US11990398B2Semiconductor package device having chip substrate with pads around photosensitive regionTONGFU MICROELECTRONICS CO LTD·Filed 2021·Granted May 21, 2024·0 cites·17 claims
- 1749US8952512B2Wafer-level package structure of light emitting diode and manufacturing method thereofCHINA WAFER LEVEL CSP LTD·Filed 2013·Granted Feb 10, 2015·0 cites·18 claims
- 1845US11655351B2Method for recycling waste polyester with continuous alcoholysis and transesterificationAVANTGARDE SHANGHAI ENVIRONMENTAL TECH CO LTD·Filed 2020·Granted May 23, 2023·0 cites·12 claims
- 1945US7755155B2Packaging structure and method for fabricating the sameCHINA WAFER LEVEL CSP LTD·Filed 2008·Granted Jul 13, 2010·0 cites·11 claims
- 2044US12272082B2Method and system for constructing bone model, medium and deviceVOSTRO MEDICAL TECH TIANJIN CO LTD·Filed 2024·Granted Apr 8, 2025·0 cites·10 claims
- 2144US2009080847A1Optical waveguide and method for manufacturing the sameSHAO MINGDA·Filed 2008·Application pending·0 cites
- 2243US2009080846A1Optical Waveguide and Method for Manufacturing the SameSHAO MINGDA·Filed 2008·Application pending·0 cites
- 2342US2010171134A1Optical converter and manufacturing method thereof and light emitting diodeCHINA WAFER LEVEL CSP LTD·Filed 2009·Application pending·0 cites
- 2440US2009102056A1Patterned Leads For WLCSP And Method For Fabricating The SameCHINA WAFER LEVEL CSP LTD·Filed 2008·Application pending·0 cites
- 2538US2010065956A1Packaging structure, packaging method and photosensitive deviceWANG ZHIQI·Filed 2009·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →