Inventor · disambiguated record
Gwang-Mun Choi
Also filed as: CHOI GWANG-MUN
9 granted patents·14 pending applications·11 citations·filing 2014–2025
78Inventor score
Files withELECTRONICS & TELECOMMUNICATIONS RES INST14KOREA ADVANCED INST SCI & TECH8SOLIP TECH CO LTD1
Top patents by PatentIndex Score
23 records- 0190US9598609B2Siloxane hard-coating resin compositionKOREA ADVANCED INST SCI & TECH·Filed 2014·Granted Mar 21, 2017·6 cites·10 claims
- 0282US10377919B2Hard coating film using composition including epoxy siloxane resin and preparing method thereofKOREA ADVANCED INST SCI & TECH·Filed 2014·Granted Aug 13, 2019·4 cites·9 claims
- 0379US10246606B2Transparent flexible hard coated film and method of producing the sameKOREA ADVANCED INST SCI & TECH·Filed 2017·Granted Apr 2, 2019·1 cites·9 claims
- 0473US2025154325A1Vanillic acid-based organic-inorganic compound, curable composition, and production method thereofELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2024·Application pending·0 cites
- 0571US2023391956A1Silyl ether isohexide-based organic-inorganic compound, method for preparing the same, and curable composition containing the sameELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2023·Application pending·0 cites
- 0669US11618109B2Wire for electric bondingELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Granted Apr 4, 2023·0 cites·13 claims
- 0765US2017145253A1Siloxane hard-coating resin compositionKOREA ADVANCED INST SCI & TECH·Filed 2017·Application pending·0 cites
- 0863US2022402070A1Laser control structure and laser bonding method using the sameELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2022·Application pending·0 cites
- 0961US12457833B2Electronic device and its repair methodELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2022·Granted Oct 28, 2025·0 cites·20 claims
- 1060US12349505B2Method of manufacturing electric deviceELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2022·Granted Jul 1, 2025·0 cites·20 claims
- 1160US2025062276A1Method for dipping adhesive materialELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2024·Application pending·0 cites
- 1258US2021252620A1Transfer and bonding method using laserELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Application pending·0 cites
- 1356US12206056B2Semiconductor package with intermetallic-compound solder-joint comprising solder, UBM, and reducing layer materialsELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Granted Jan 21, 2025·0 cites·20 claims
- 1456US2024021570A1Bonding apparatusELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2023·Application pending·0 cites
- 1555US2023326810A1Microwave heating device and method for manufacturing semiconductor packaging using the sameELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2023·Application pending·0 cites
- 1653US2015004334A1Foldable transparent composite cover window, manufacturing method of the same, and foldable display device containing the sameKOREA ADVANCED INST SCI & TECH·Filed 2014·Application pending·0 cites
- 1752US11677060B2Method for transferring and bonding of devicesELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Granted Jun 13, 2023·0 cites·12 claims
- 1850US2025282908A1Flux agent and semiconductor package including cured product thereofELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2025·Application pending·0 cites
- 1949US10858539B2Siloxane hard-coating resin compositionKOREA ADVANCED INST SCI & TECH·Filed 2018·Granted Dec 8, 2020·0 cites·14 claims
- 2049US2022077099A1Composition for conductive adhesive, semiconductor package comprising cured product thereof, and method of manufacturing semiconductor package using the sameELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Application pending·0 cites
- 2140US2015353760A1Transparent flexible hard coated film and method of producing the sameKOREA ADVANCED INST SCI & TECH·Filed 2015·Application pending·0 cites
- 2236US2017335180A1Semiconductor nanocrystal-siloxane composite resin composition and preparation method thereofKOREA ADVANCED INST SCI & TECH·Filed 2017·Application pending·0 cites
- 2330US2016060398A1Method of manufacturing cationic polymerization resin with enhanced uv stability and cationic polymerization resin manufactured by the sameSOLIP TECH CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →