Inventor · disambiguated record
Gwang Jae Jeon
Also filed as: JEON GWANG JAE
5 granted patents·1 pending application·4 citations·filing 2019–2022
67Inventor score
Files withSAMSUNG ELECTRONICS CO LTD6
Top patents by PatentIndex Score
6 records- 0189US11373980B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 28, 2022·3 cites·20 claims
- 0281US11328970B2Methods of fabricating semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 10, 2022·1 cites·17 claims
- 0370US12046526B2Methods of fabricating semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 23, 2024·0 cites·16 claims
- 0469US11715645B2Method for fabricating semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 1, 2023·0 cites·20 claims
- 0561US11322368B2Method for fabricating semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 3, 2022·0 cites·20 claims
- 0640US2020273804A1Semiconductor devices having conductive pillars and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →