Inventor · disambiguated record
Gwangjae Jeon
Also filed as: JEON GWANGJAE
14 granted patents·11 pending applications·9 citations·filing 2020–2025
86Inventor score
Files withSAMSUNG ELECTRONICS CO LTD25
Top patents by PatentIndex Score
25 records- 0193US11929316B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 12, 2024·2 cites·20 claims
- 0290US11646260B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 9, 2023·2 cites·20 claims
- 0388US11705341B2Method of fabricating a semiconductor package having redistribution patterns including seed patterns and seed layersSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 18, 2023·1 cites·20 claims
- 0487US11348864B2Redistribution substrate having redistribution pattern including via seed patterns covering bottom surface and sidewall surface of wiring conductive patterns and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 31, 2022·2 cites·19 claims
- 0584US11948872B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 2, 2024·1 cites·20 claims
- 0679US12230556B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Feb 18, 2025·0 cites·16 claims
- 0779US11056461B2Method of manufacturing fan-out wafer level packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 6, 2021·1 cites·19 claims
- 0874US12394700B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 19, 2025·0 cites·20 claims
- 0970US2023420402A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1069US2025149418A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1167US12451449B2Semiconductor package, and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 21, 2025·0 cites·20 claims
- 1267US2025253221A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1362US11804427B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 31, 2023·0 cites·11 claims
- 1461US2025183216A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1560US2025079249A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1659US12300589B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 13, 2025·0 cites·16 claims
- 1758US11791295B2Semiconductor package with thick under-bump terminalSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 17, 2023·0 cites·19 claims
- 1858US2024234349A9Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1958US2024413026A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2057US2024096831A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2157US2024421140A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2256US2024072006A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2354US11508649B2Semiconductor package including substrate with outer insulating layerSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 22, 2022·0 cites·20 claims
- 2453US11837551B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 5, 2023·0 cites·16 claims
- 2553US2023025903A1Semiconductor package including redistribution structure and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →