Inventor · disambiguated record
Gwanghee Jo
Also filed as: JO GWANGHEE
2 granted patents·2 pending applications·3 citations·filing 2020–2024
42Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD4
Top patents by PatentIndex Score
4 records- 0181US12027401B2Semiconductor substrate alignment device and a semiconductor substrate bonding system using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 2, 2024·2 cites·20 claims
- 0267US11443965B2Wafer to wafer bonding apparatusesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 13, 2022·1 cites·20 claims
- 0349US2024242981A1Substrate bonding apparatus and method of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0446US2024153906A1Substrate bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Gwanghee Jo files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →