Inventor · disambiguated record
Gwangjin Kim
Also filed as: KIM GWANGJIN
4 granted patents·10 citations·filing 2007–2012
67Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0178US9125332B2Filp chip interconnection structure with bump on partial pad and method thereofPENDSE RAJENDRA D·Filed 2010·Granted Sep 1, 2015·5 cites·27 claims
- 0267US9142481B2Integrated circuit packaging system with heatsink cap and method of manufacture thereofKIM GWANGJIN·Filed 2012·Granted Sep 22, 2015·4 cites·9 claims
- 0356US7759137B2Flip chip interconnection structure with bump on partial pad and method thereofSTATS CHIPPAC LTD·Filed 2008·Granted Jul 20, 2010·1 cites·19 claims
- 0433US8592989B2Integrated circuit package system with bump over viaNA GUICHEA·Filed 2007·Granted Nov 26, 2013·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →