Inventor · disambiguated record
Gwangtae Kim
Also filed as: KIM GWANGTAE
4 granted patents·1 pending application·18 citations·filing 2013–2024
70Inventor score
Top patents by PatentIndex Score
5 records- 0181US9693455B1Integrated circuit packaging system with plated copper posts and method of manufacture thereofPARK SEONG WON·Filed 2014·Granted Jun 27, 2017·10 cites·20 claims
- 0278US9076802B1Dual-sided film-assist molding processKO WONJUN·Filed 2013·Granted Jul 7, 2015·6 cites·18 claims
- 0362US9279673B2Semiconductor device and method of calibrating warpage testing system to accurately measure semiconductor package warpageSTATS CHIPPAC LTD·Filed 2013·Granted Mar 8, 2016·1 cites·25 claims
- 0461US2025125158A1Method for attaching a heat spreader to a semiconductor package and semiconductor package assembliesSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 0560US10840274B2Thin film transistor and display deviceLG DISPLAY CO LTD·Filed 2016·Granted Nov 17, 2020·1 cites·24 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →