Inventor · disambiguated record
Gwang Kim
Also filed as: KIM GWANG · KIM GWANG-SICK
6 granted patents·1 pending application·4 citations·filing 2011–2024
71Inventor score
Top patents by PatentIndex Score
7 records- 0191US11887863B2Double-sided partial molded SIP moduleSTATS CHIPPAC PTE LTD·Filed 2021·Granted Jan 30, 2024·2 cites·19 claims
- 0278US12211803B2Semiconductor device and method of forming semiconductor package with RF antenna interposer having high dielectric encapsulationSTATS CHIPPAC PTE LTD·Filed 2023·Granted Jan 28, 2025·0 cites·22 claims
- 0376US12374559B2Double-sided partial molded SiP moduleSTATS CHIPPAC PTE LTD·Filed 2023·Granted Jul 29, 2025·0 cites·18 claims
- 0468US11894314B2Semiconductor device and method of forming semiconductor package with RF antenna interposer having high dielectric encapsulationSTATS CHIPPAC PTE LTD·Filed 2021·Granted Feb 6, 2024·0 cites·25 claims
- 0561US9129998B2Apparatus for cleaning an object and method of operating the sameKIM GWANG-SICK·Filed 2012·Granted Sep 8, 2015·2 cites·13 claims
- 0660US2024290671A1Semiconductor package with improved space utilization and method for making the sameSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 0741US8481371B2Thin package system with external terminals and method of manufacture thereofKIM YOUNGCHEOL·Filed 2011·Granted Jul 9, 2013·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →