Inventor · disambiguated record
Gyujin Choi
Also filed as: CHOI GYUJIN
9 granted patents·13 pending applications·7 citations·filing 2019–2024
79Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD22
Top patents by PatentIndex Score
22 records- 0191US11990439B2Semiconductor package including under bump metallization padSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 21, 2024·4 cites·15 claims
- 0285US11373955B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 28, 2022·2 cites·20 claims
- 0370US2024266269A1Semiconductor package deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0468US12489060B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 2, 2025·0 cites·20 claims
- 0568US11961812B2Semiconductor packages having viasSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Apr 16, 2024·0 cites·20 claims
- 0664US11978696B2Semiconductor package deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 7, 2024·0 cites·20 claims
- 0762US11810864B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 7, 2023·0 cites·19 claims
- 0862US11264339B2Method of manufacturing connection structure of semiconductor chip and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 1, 2022·1 cites·14 claims
- 0960US11587898B2Semiconductor packages having viasSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 21, 2023·0 cites·20 claims
- 1060US2025140728A1Semiconductor package with redistribution structureSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1159US2025022785A1Semiconductor chip and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1259US2025079317A1Semiconductor package including a redistribution structureSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1359US2025226274A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1458US2025140771A1Semiconductor package including a core layerSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1558US2025046769A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1657US2025096201A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1757US2024404936A1Stacked structure including conductive pattern for self-alignmentSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1855US2024304557A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1955US2024387486A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2055US2024347487A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2154US2025149518A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2244US11972966B2Method of manufacturing a semiconductor package including correcting alignment error while forming redistribution wiring strutureSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 30, 2024·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →