Inventor · disambiguated record
Gyeong S. Hwang
Also filed as: HWANG GYEONG S · HWANG GYEONG SEOK
5 granted patents·4 pending applications·55 citations·filing 2002–2023
77Inventor score
Files withUNIV TEXAS3CALIFORNIA INST OF TECHN2SEMES CO LTD2HWANG GYEONG S1SAMSUNG ELECTRONICS CO LTD1
Top patents by PatentIndex Score
9 records- 0181US7756687B2Method for predicting contributions of silicon interstitials to n-type dopant transient enhanced diffusion during a pn junction formationHWANG GYEONG S·Filed 2006·Granted Jul 13, 2010·19 cites·15 claims
- 0278US6685772B2De novo processing of electronic materialsCALIFORNIA INST OF TECHN·Filed 2002·Granted Feb 3, 2004·30 cites·30 claims
- 0373US11884075B2Inkjet head cleaning apparatus and inkjet printing equipment including sameSEMES CO LTD·Filed 2022·Granted Jan 30, 2024·0 cites·20 claims
- 0454US7074270B2Method for predicting the behavior of dopant and defect componentsCALIFORNIA INST OF TECHN·Filed 2003·Granted Jul 11, 2006·5 cites·8 claims
- 0554US2024304855A1Inorganic solid electrolyte interphase layers, batteries containing the same, and methods of making the sameUNIV TEXAS·Filed 2022·Application pending·0 cites
- 0653US8036864B2Method for predicting the formation of silicon nanocrystals in embedded oxide matricesUNIV TEXAS·Filed 2006·Granted Oct 11, 2011·1 cites·26 claims
- 0753US2025233151A1Composite materials forming solid interphase layers, batteries containing the same, and methods of making the sameUNIV TEXAS·Filed 2023·Application pending·0 cites
- 0853US2023352325A1Apparatus and method for dispensing treatment liquidSEMES CO LTD·Filed 2023·Application pending·0 cites
- 0944US2011220165A1Thermoelectric device including thermoelectric body including vacancy clusterSAMSUNG ELECTRONICS CO LTD·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Gyeong S. Hwang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →