Inventor · disambiguated record

Gyeongjae Jo

Also filed as: JO GYEONGJAE

0 granted patents·2 pending applications·0 citations·filing 2024–2024

Technology areasH10W

Files withSAMSUNG ELECTRONICS CO LTD2

Top patents by PatentIndex Score

2 records

0156US2025087624A1Semiconductor chip bonding apparatus and semiconductor package manufacturing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
0255US2024395764A1Bonding apparatus for semiconductor device and method of bonding semiconductor devices using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →