Inventor · disambiguated record
Gyu-Hee Park
Also filed as: PARK GYU-HEE
18 granted patents·5 pending applications·21 citations·filing 2015–2024
89Inventor score
Files withSAMSUNG ELECTRONICS CO LTD23
Top patents by PatentIndex Score
23 records- 0186US9637511B2Method of forming thin film using a heterostructured nickel compoundSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted May 2, 2017·4 cites·12 claims
- 0284US9391089B2Method of manufacturing semiconductor device including nickel-containing filmSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jul 12, 2016·4 cites·18 claims
- 0379US9923047B2Method for manufacturing a capacitor for semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Mar 20, 2018·3 cites·19 claims
- 0478US10913754B2Lanthanum compound and methods of forming thin film and integrated circuit device using the lanthanum compoundSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 9, 2021·2 cites·15 claims
- 0578US10259836B2Methods of forming thin film and fabricating integrated circuit device using niobium compoundSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Apr 16, 2019·3 cites·20 claims
- 0675US10224200B2Aluminum compound, method of forming thin film by using the same, and method of fabricating integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Mar 5, 2019·2 cites·8 claims
- 0770US10242877B2Aluminum compound and methods of forming thin film and fabricating integrated circuit device by using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Mar 26, 2019·1 cites·16 claims
- 0869US10468264B2Method of fabricating semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Nov 5, 2019·1 cites·14 claims
- 0967US10329312B2Lanthanum compound, method of synthesizing lanthanum compound, lanthanum precursor composition, method of forming thin film, and method of manufacturing integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jun 25, 2019·0 cites·16 claims
- 1066US10847362B2Method of fabricating semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 24, 2020·1 cites·19 claims
- 1166US2025154648A1Precursor for forming metal thin film, manufacturing method using the same, and metal thin film manufactured therebySAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1262US2025179627A1Composition for depositing a molybdenum-containing thin film, method for manufacturing a molybdenum-containing thin film, and molybdenum-containing thin film manufactured therebySAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1361US10752645B2Method of forming a thin filmSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 25, 2020·0 cites·9 claims
- 1459US2025157809A1Thin-film forming composition including aluminum compound, method of forming thin film by using the thin-film forming composition, and method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1555US9790246B2Nickel compound and method of forming thin film using the nickel compoundSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 17, 2017·0 cites·3 claims
- 1654US11901191B2Atomic layer etching method and semiconductor device manufacturing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 13, 2024·0 cites·19 claims
- 1754US11524973B2Metal compounds and methods of fabricating semiconductor devices using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 13, 2022·0 cites·20 claims
- 1853US11081389B2Method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 3, 2021·0 cites·20 claims
- 1952US2021380622A1Materials for fabricating thin films, methods of fabricating thin films using the same, and equipment for fabricating thin films using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Application pending·0 cites
- 2051US2023220213A1Compositions for manufacturing thin film and methods for manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2147US11332486B2Aluminum compound and method for manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 17, 2022·0 cites·11 claims
- 2247US10600643B2Method of forming thin film and method of manufacturing integrated circuit device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Mar 24, 2020·0 cites·14 claims
- 2346US12051586B2Method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 30, 2024·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →