Inventor · disambiguated record
H. Ward Conru
Also filed as: CONRU H WARD
4 granted patents·260 citations·filing 1988–1994
80Inventor score
Technology areasH10W
Files withIBM4
Top patents by PatentIndex Score
4 records- 0190US5086018AMethod of making a planarized thin film covered wire bonded semiconductor packageIBM·Filed 1991·Granted Feb 4, 1992·155 cites·11 claims
- 0277US5151559APlanarized thin film surface covered wire bonded semiconductor packageIBM·Filed 1991·Granted Sep 29, 1992·61 cites·9 claims
- 0371US4907734AMethod of bonding gold or gold alloy wire to lead tin solderIBM·Filed 1988·Granted Mar 13, 1990·42 cites·12 claims
- 0428US6002164ASemiconductor lead frameIBM·Filed 1994·Granted Dec 14, 1999·2 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →