Inventor · disambiguated record
Haruo Akahoshi
Also filed as: AKAHOSHI HARUO
71 granted patents·32 pending applications·1,990 citations·filing 1984–2014
99Inventor score
Top patents by PatentIndex Score
103 records- 0198US6680540B2Semiconductor device having cobalt alloy film with boronHITACHI LTD·Filed 2001·Granted Jan 20, 2004·205 cites·15 claims
- 0295US8741380B2Fine metal structure, process for producing the same, fine metal mold and deviceYOSHIDA HIROSHI·Filed 2010·Granted Jun 3, 2014·12 cites·9 claims
- 0395US7478925B2Lighting source unit, illuminating apparatus using the same and display apparatus using the sameHITACHI DISPLAYS LTD·Filed 2005·Granted Jan 20, 2009·36 cites·22 claims
- 0494US6028364ASemiconductor device having a stress relieving mechanismHITACHI LTD·Filed 1995·Granted Feb 22, 2000·167 cites·19 claims
- 0594US5565706ALSI package boardHITACHI LTD·Filed 1995·Granted Oct 15, 1996·190 cites·24 claims
- 0693US4642161AMethod of bonding copper and resinHITACHI LTD·Filed 1986·Granted Feb 10, 1987·113 cites·11 claims
- 0792US5595943AMethod for formation of conductor using electroless platingHITACHI LTD·Filed 1995·Granted Jan 21, 1997·125 cites·3 claims
- 0891US6627997B1Semiconductor module and method of mountingHITACHI LTD·Filed 1999·Granted Sep 30, 2003·124 cites·8 claims
- 0991US5021296ACircuit board and process for producing the sameHITACHI LTD·Filed 1989·Granted Jun 4, 1991·66 cites·33 claims
- 1090US8479970B2High corrosion resistant equipment for a plantISHIBASHI RYO·Filed 2012·Granted Jul 9, 2013·11 cites·8 claims
- 1187US6784541B2Semiconductor module and mounting method for sameHITACHI LTD·Filed 2002·Granted Aug 31, 2004·37 cites·10 claims
- 1286US8022431B2Illuminating apparatus, method for fabricating the using the same and display apparatus using the sameHITACHI DISPLAYS LTD·Filed 2005·Granted Sep 20, 2011·9 cites·18 claims
- 1386US7666320B2Manufacturing method of printed wiring board as well as copper-clad laminate and treatment solutions used thereforHITACHI VIA MECHANICS LTD·Filed 2006·Granted Feb 23, 2010·11 cites·7 claims
- 1486US6710446B2Semiconductor device comprising stress relaxation layers and method for manufacturing the sameRENESAS TECH CORP·Filed 2002·Granted Mar 23, 2004·44 cites·10 claims
- 1586US4970107AComposite article comprising a copper element and a process for producing itHITACHI LTD·Filed 1989·Granted Nov 13, 1990·50 cites·34 claims
- 1685US4604160AMethod for manufacture of printed wiring boardHITACHI LTD·Filed 1985·Granted Aug 5, 1986·87 cites·18 claims
- 1784US8387255B2Fine pattern moldOGINO MASAHIKO·Filed 2011·Granted Mar 5, 2013·7 cites·3 claims
- 1883US8995046B2Suspended particle device, light control device using the same, and driving methodHITACHI CHEMICAL CO LTD·Filed 2013·Granted Mar 31, 2015·6 cites·21 claims
- 1983US7638564B2Low dielectric loss tangent-resin varnish, prepreg, laminated sheet, and printed wiring board using the varnishHITACHI CHEMICAL CO LTD·Filed 2006·Granted Dec 29, 2009·4 cites·7 claims
- 2083US6423571B2Method of making a semiconductor device having a stress relieving mechanismHITACHI LTD·Filed 2001·Granted Jul 23, 2002·35 cites·19 claims
- 2181US7661866B2Lighting system and display apparatus using the sameHITACHI DISPLAYS LTD·Filed 2006·Granted Feb 16, 2010·9 cites·16 claims
- 2281US6300244B1Semiconductor device and method of manufacturing the sameHITACHI LTD·Filed 1999·Granted Oct 9, 2001·57 cites·18 claims
- 2380US7226690B2Catalyst material and method of manufacturing the same and fuel cell using the sameHITACHI LTD·Filed 2005·Granted Jun 5, 2007·4 cites·15 claims
- 2480US6940162B2Semiconductor module and mounting method for sameRENESAS TECH CORP·Filed 2004·Granted Sep 6, 2005·23 cites·24 claims
- 2580US6805915B2Electroless copper plating solution, electroless copper plating process and production process of circuit boardHITACHI LTD·Filed 2002·Granted Oct 19, 2004·15 cites·8 claims
- 2680US5028513AProcess for producing printed circuit boardHITACHI LTD·Filed 1989·Granted Jul 2, 1991·40 cites·21 claims
- 2779US8366903B2Method for manufacturing printed wiring board and electrolytic etching solution for use in the manufacturing methodHitachi Via Mechanics·Filed 2008·Granted Feb 5, 2013·10 cites·4 claims
- 2879US6475680B1Lithium secondary battery, its electrolyte, and electric apparatus using the sameHITACHI LTD·Filed 1999·Granted Nov 5, 2002·63 cites·7 claims
- 2978US6495769B1Wiring board and production method thereof, and semiconductor apparatusHITACHI LTD·Filed 2000·Granted Dec 17, 2002·17 cites·20 claims
- 3076US6924971B2High dielectric constant composite material and multilayer wiring board using the sameHITACHI LTD·Filed 2002·Granted Aug 2, 2005·19 cites·2 claims
- 3175US5472563APrinted circuit board and method and apparatus for making sameHITACHI LTD·Filed 1994·Granted Dec 5, 1995·40 cites·14 claims
- 3274US6511588B1Plating method using an additiveHITACHI LTD·Filed 2000·Granted Jan 28, 2003·19 cites·7 claims
- 3373US9234861B2Electrode for electrochemical measurement, electrolysis cell for electrochemical measurement, analyzer for electrochemical measurement, and methods for producing sameKANEMOTO HIROSHI·Filed 2011·Granted Jan 12, 2016·2 cites·6 claims
- 3473US7095623B2Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatusHITACHI LTD·Filed 2003·Granted Aug 22, 2006·15 cites·13 claims
- 3572US8083515B2Fine pattern moldOGINO MASAHIKO·Filed 2008·Granted Dec 27, 2011·2 cites·8 claims
- 3672US7235324B2Catalyst material and method of manufacturing the same and fuel cell using the sameHITACHI LTD·Filed 2004·Granted Jun 26, 2007·10 cites·19 claims
- 3771US6815357B2Process and apparatus for manufacturing a semiconductor deviceRENESAS TECH CORP·Filed 2002·Granted Nov 9, 2004·16 cites·25 claims
- 3871US5457079ACopper-based oxidation catalyst and its applicationsHITACHI LTD·Filed 1993·Granted Oct 10, 1995·25 cites·15 claims
- 3970US6396145B1Semiconductor device and method for manufacturing the same technical fieldHITACHI LTD·Filed 1998·Granted May 28, 2002·38 cites·26 claims
- 4069US7875387B2Electrode for use in electrochemical device, solid electrolyte/electrode assembly, and production method thereofHITACHI CABLE·Filed 2006·Granted Jan 25, 2011·1 cites·15 claims
- 4169US5707749AMethod for producing thin film multilayer wiring boardHITACHI LTD·Filed 1995·Granted Jan 13, 1998·31 cites·4 claims
- 4268US7022412B2Member having metallic layer, its manufacturing method and its applicationHITACHI LTD·Filed 2003·Granted Apr 4, 2006·5 cites·3 claims
- 4367US6831009B2Wiring substrate and an electroless copper plating solution for providing interlayer connectionsHITACHI LTD·Filed 2001·Granted Dec 14, 2004·7 cites·4 claims
- 4464US8097545B2Phase-separation-controlled polybutadiene resin composition and printed wiring board using the resin compositionAMOU SATORU·Filed 2007·Granted Jan 17, 2012·2 cites·11 claims
- 4564US7170012B2Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatusHITACHI LTD·Filed 2005·Granted Jan 30, 2007·2 cites·5 claims
- 4664US6900394B1Electroless copper plating machine, and multi-layer printed wiring boardHITACHI LTD·Filed 2000·Granted May 31, 2005·5 cites·4 claims
- 4764US4865888AProcess for electroless copper plating and apparatus used thereforHITACHI LTD·Filed 1988·Granted Sep 12, 1989·23 cites·21 claims
- 4863US7169216B2Electroless copper plating solution, electroless copper plating process and production process of circuit boardHITACHI LTD·Filed 2004·Granted Jan 30, 2007·4 cites·3 claims
- 4961US7220481B2High dielectric constant composite material and multilayer wiring board using the sameHITACHI LTD·Filed 2002·Granted May 22, 2007·8 cites·7 claims
- 5061US2007079727A1Electroless copper plating solution, electroless copper plating process and production process of circuit boardITABASHI TAKEYUKI·Filed 2006·Application pending·0 cites
Showing the top 50 of 103 patent records by PatentIndex Score.
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