Inventor · disambiguated record
Hans-Joachim Barth
Also filed as: BARTH HANS · BARTH HANS-JOACHIM
91 granted patents·14 pending applications·1,142 citations·filing 1987–2022
99Inventor score
Files withINFINEON TECHNOLOGIES AG45BARTH HANS-JOACHIM25INTEL CORP16INTEL IP CORP5INTEL DEUTSCHLAND GMBH3
Top patents by PatentIndex Score
105 records- 0196US9385105B2Semiconductor devicesINTEL DEUTSCHLAND GMBH·Filed 2013·Granted Jul 5, 2016·52 cites·8 claims
- 0296US8772087B2Method and apparatus for semiconductor device fabrication using a reconstituted waferBARTH HANS-JOACHIM·Filed 2009·Granted Jul 8, 2014·43 cites·26 claims
- 0396US7786584B2Through substrate via semiconductor componentsINFINEON TECHNOLOGIES AG·Filed 2007·Granted Aug 31, 2010·45 cites·25 claims
- 0496US6949442B2Methods of forming MIM capacitorsINFINEON TECHNOLOGIES AG·Filed 2003·Granted Sep 27, 2005·112 cites·43 claims
- 0595US9209136B2Hybrid carbon-metal interconnect structuresINTEL CORP·Filed 2013·Granted Dec 8, 2015·16 cites·9 claims
- 0695US8169059B2On-chip RF shields with through substrate conductorsBARTH HANS-JOACHIM·Filed 2008·Granted May 1, 2012·38 cites·42 claims
- 0795US7812424B2Moisture barrier capacitors in semiconductor componentsINFINEON TECHNOLOGIES AG·Filed 2007·Granted Oct 12, 2010·23 cites·21 claims
- 0894US9627804B2Snap button fastener providing electrical connectionINTEL CORP·Filed 2014·Granted Apr 18, 2017·18 cites·7 claims
- 0994US9536409B1System and method for accident avoidance during mobile device usageINTEL IP CORP·Filed 2015·Granted Jan 3, 2017·9 cites·28 claims
- 1094US8148257B1Semiconductor structure and method for making sameBARTH HANS-JOACHIM·Filed 2010·Granted Apr 3, 2012·24 cites·6 claims
- 1194US7948064B2System on a chip with on-chip RF shieldINFINEON TECHNOLOGIES AG·Filed 2008·Granted May 24, 2011·29 cites·30 claims
- 1293US8178953B2On-chip RF shields with front side redistribution linesBARTH HANS-JOACHIM·Filed 2008·Granted May 15, 2012·22 cites·25 claims
- 1391US7193263B2Electronic component having an integrated passive electronic component and associated production methodINFINEON TECHNOLOGIES AG·Filed 2005·Granted Mar 20, 2007·22 cites·27 claims
- 1491US6730982B2FBEOL process for Cu metallizations free from Al-wirebond padsINFINEON TECHNOLOGIES AG·Filed 2001·Granted May 4, 2004·74 cites·16 claims
- 1590US10003028B2Hybrid carbon-metal interconnect structuresINTEL CORP·Filed 2017·Granted Jun 19, 2018·5 cites·20 claims
- 1690US7936052B2On-chip RF shields with backside redistribution linesINFINEON TECHNOLOGIES AG·Filed 2008·Granted May 3, 2011·19 cites·19 claims
- 1789US11342720B2Snap button fastener providing electrical connectionINTEL CORP·Filed 2020·Granted May 24, 2022·2 cites·30 claims
- 1889US10394280B2Wearable electronic devices and components thereofINTEL CORP·Filed 2018·Granted Aug 27, 2019·6 cites·6 claims
- 1989US8269341B2Cooling structures and methodsBARTH HANS-JOACHIM·Filed 2008·Granted Sep 18, 2012·16 cites·43 claims
- 2089US7879727B2Method of fabricating a semiconductor device including a pattern of line segmentsINFINEON TECHNOLOGIES AG·Filed 2009·Granted Feb 1, 2011·22 cites·16 claims
- 2188US10049932B2Method of manufacturing of a sidewall opening of an interconnect of a semiconductor deviceINTEL DEUTSCHLAND GMBH·Filed 2017·Granted Aug 14, 2018·4 cites·6 claims
- 2288US7755196B2Method for production of an integrated circuit bar arrangement, in particular comprising a capacitor assembly, as well as an integrated circuit arrangementINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jul 13, 2010·15 cites·7 claims
- 2388US6908841B2Support structures for wirebond regions of contact pads over low modulus materialsIBM·Filed 2002·Granted Jun 21, 2005·56 cites·36 claims
- 2488US6451664B1Method of making a MIM capacitor with self-passivating platesINFINEON TECHNOLOGIES AG·Filed 2001·Granted Sep 17, 2002·51 cites·17 claims
- 2587US10886680B2Snap button fastener providing electrical connectionINTEL CORP·Filed 2019·Granted Jan 5, 2021·3 cites·9 claims
- 2687US9904321B2Wearable electronic devices and components thereofINTEL CORP·Filed 2014·Granted Feb 27, 2018·6 cites·10 claims
- 2787US8138539B2Semiconductor devices and methods of manufacture thereofBARTH HANS-JOACHIM·Filed 2007·Granted Mar 20, 2012·14 cites·25 claims
- 2886US8063469B2On-chip radio frequency shield with interconnect metallizationBARTH HANS-JOACHIM·Filed 2008·Granted Nov 22, 2011·14 cites·24 claims
- 2986US7986023B2Semiconductor device with inductorINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jul 26, 2011·15 cites·24 claims
- 3086US7777300B2Semiconductor device with capacitorINFINEON TECHNOLOGIES AG·Filed 2007·Granted Aug 17, 2010·16 cites·52 claims
- 3186US7285490B2Method for the producing an integrated circuit bar arrangement, in particular comprising a capacitor assembly, in addition to an integrated circuit arrangementINFINEON TECHNOLOGIES AG·Filed 2005·Granted Oct 23, 2007·13 cites·31 claims
- 3285US10193288B2Snap button fastener providing electrical connectionINTEL CORP·Filed 2017·Granted Jan 29, 2019·5 cites·14 claims
- 3385US9786733B2Moisture barrier capacitors in semiconductor componentsINFINEON TECHNOLOGIES AG·Filed 2015·Granted Oct 10, 2017·3 cites·18 claims
- 3485US9564400B2Methods of forming stacked microelectronic dice embedded in a microelectronic substrateINTEL CORP·Filed 2016·Granted Feb 7, 2017·4 cites·19 claims
- 3584US8536683B2System on a chip with on-chip RF shieldBARTH HANS-JOACHIM·Filed 2011·Granted Sep 17, 2013·6 cites·31 claims
- 3684US6893959B2Method to form selective cap layers on metal features with narrow spacesINFINEON TECHNOLOGIES AG·Filed 2003·Granted May 17, 2005·31 cites·36 claims
- 3782US7875977B2Barrier layers for conductive featuresINFINEON TECHNOLOGIES AG·Filed 2008·Granted Jan 25, 2011·9 cites·20 claims
- 3882US7440334B2Multi-transistor memory cellsINFINEON TECHNOLOGIES AG·Filed 2006·Granted Oct 21, 2008·15 cites·32 claims
- 3981US8889548B2On-chip RF shields with backside redistribution linesBARTH HANS-JOACHIM·Filed 2011·Granted Nov 18, 2014·4 cites·29 claims
- 4081US8525347B2Method for producing chip stacks, and associated chip stacksBARTH HANS-JOACHIM·Filed 2006·Granted Sep 3, 2013·6 cites·8 claims
- 4181US6559042B2Process for forming fusible linksIBM·Filed 2001·Granted May 6, 2003·33 cites·5 claims
- 4281US6515373B2Cu-pad/bonded/Cu-wire with self-passivating Cu-alloysINFINEON TECHNOLOGIES AG·Filed 2000·Granted Feb 4, 2003·31 cites·7 claims
- 4380US7635908B2Corresponding capacitor arrangement and method for making the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Dec 22, 2009·7 cites·6 claims
- 4479US9680105B2Hybrid carbon-metal interconnect structuresINTEL CORP·Filed 2015·Granted Jun 13, 2017·2 cites·24 claims
- 4579US9209143B2Die edge side connectionINTEL IP CORP·Filed 2013·Granted Dec 8, 2015·5 cites·24 claims
- 4679US7449409B2Barrier layer for conductive featuresINFINEON TECHNOLOGIES AG·Filed 2005·Granted Nov 11, 2008·8 cites·17 claims
- 4778US7732898B2Electrical fuse and associated methodsINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jun 8, 2010·7 cites·39 claims
- 4878US6750129B2Process for forming fusible linksINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jun 15, 2004·27 cites·27 claims
- 4977US9245799B2Semiconductor device and method of manufacturing thereofBARTH HANS-JOACHIM·Filed 2012·Granted Jan 26, 2016·3 cites·25 claims
- 5077US7615440B2Capacitor and method of manufacturing a capacitorINFINEON TECHNOLOGIES AG·Filed 2007·Granted Nov 10, 2009·7 cites·21 claims
Showing the top 50 of 105 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →