Inventor · disambiguated record
Harald Beyer
Also filed as: BEYER HARALD
7 granted patents·5 pending applications·1 citations·filing 2015–2024
69Inventor score
Top patents by PatentIndex Score
12 records- 0169US2024355704A1Power semiconductor moduleHITACHI ENERGY LTD·Filed 2024·Application pending·0 cites
- 0256US12062591B2Power semiconductor module with baseplate and heat dissipating elementHITACHI ENERGY LTD·Filed 2021·Granted Aug 13, 2024·0 cites·20 claims
- 0356US9559024B2Power semiconductor moduleABB SCHWEIZ AG·Filed 2015·Granted Jan 31, 2017·1 cites·10 claims
- 0455US12125767B2Clamping element and method for producing a power semiconductor deviceHITACHI ENERGY LTD·Filed 2022·Granted Oct 22, 2024·0 cites·14 claims
- 0554US12218192B2Metal substrate structure for a semiconductor power moduleHITACHI ENERGY LTD·Filed 2022·Granted Feb 4, 2025·0 cites·21 claims
- 0650US2025062242A1Power module and method for manufacturing a power moduleHITACHI ENERGY LTD·Filed 2022·Application pending·0 cites
- 0749US12494409B2Power semiconductor componentHITACHI ENERGY LTD·Filed 2021·Granted Dec 9, 2025·0 cites·15 claims
- 0848US11502434B2Power semiconductor moduleHITACHI ENERGY SWITZERLAND AG·Filed 2019·Granted Nov 15, 2022·0 cites·20 claims
- 0948US2023420271A1Semiconductor power module and method for manufacturing a semiconductor power module for a semiconductor device and semiconductor deviceHITACHI ENERGY SWITZERLAND AG·Filed 2023·Application pending·0 cites
- 1046US2024120255A1Power semiconductor module, power semiconductor device and method for producing a power semiconductor deviceHITACHI ENERGY SWITZERLAND AG·Filed 2022·Application pending·0 cites
- 1145US12489039B2Pre-product, method and electronic deviceHITACHI ENERGY LTD·Filed 2021·Granted Dec 2, 2025·0 cites·11 claims
- 1242US2023317684A1Power Semiconductor Module and Manufacturing MethodHITACHI ENERGY SWITZERLAND AG·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →