Inventor · disambiguated record

Hangwei Cai

Also filed as: CAI HANGWEI

1 granted patent·1 pending application·0 citations·filing 2018–2023

11Inventor score

Technology areasB22F Y10T

Files withSOLDERWELL ADVANCED MAT CO LTD1 SOLDERWELL MICROELECTRONIC PACKAGING MAT CO LTD1

Top patents by PatentIndex Score

2 records

0148US2024009731A1Nano silver paste and preparation method thereofSOLDERWELL MICROELECTRONIC PACKAGING MAT CO LTD·Filed 2023·Application pending·0 cites
0232US11207748B2Solder preformSOLDERWELL ADVANCED MAT CO LTD·Filed 2018·Granted Dec 28, 2021·0 cites·8 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →