Inventor · disambiguated record
Hao-Chuan Chang
Also filed as: CHANG HAO-CHUAN
9 granted patents·4 pending applications·6 citations·filing 2019–2025
78Inventor score
Files withWINBOND ELECTRONICS CORP13
Top patents by PatentIndex Score
13 records- 0192US11751380B2Semiconductor memory structureWINBOND ELECTRONICS CORP·Filed 2021·Granted Sep 5, 2023·4 cites·20 claims
- 0286US11430792B2Dynamic random-access memoryWINBOND ELECTRONICS CORP·Filed 2020·Granted Aug 30, 2022·2 cites·13 claims
- 0370US2025300070A1Method for forming semiconductor structureWINBOND ELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0467US12347766B2Semiconductor structure and method for forming the sameWINBOND ELECTRONICS CORP·Filed 2022·Granted Jul 1, 2025·0 cites·10 claims
- 0567US11923449B2Manufacturing method for semiconductor deviceWINBOND ELECTRONICS CORP·Filed 2022·Granted Mar 5, 2024·0 cites·20 claims
- 0663US11665879B2Method of manufacturing dynamic random-access memoryWINBOND ELECTRONICS CORP·Filed 2022·Granted May 30, 2023·0 cites·17 claims
- 0758US11367787B2Semiconductor device and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2019·Granted Jun 21, 2022·0 cites·13 claims
- 0858US2025098250A1Semiconductor structure and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0958US2024155835A1Dynamic random access memory and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 1058US2025227923A1Semiconductor structure and formation method thereofWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1152US11784087B2Semiconductor structure having layers in a trench and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2021·Granted Oct 10, 2023·0 cites·16 claims
- 1250US12302546B2Semiconductor memory structureWINBOND ELECTRONICS CORP·Filed 2022·Granted May 13, 2025·0 cites·20 claims
- 1347US11665916B2Memory devices and methods for forming the sameWINBOND ELECTRONICS CORP·Filed 2020·Granted May 30, 2023·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →