Inventor · disambiguated record
Haobo Chen
Also filed as: CHEN HAOBO
11 granted patents·83 pending applications·15 citations·filing 2017–2024
83Inventor score
Files withINTEL CORP90NINGBO HAWK ELECTRICAL APPLIANCE CO LTD1SHAN BOHAN1SHENZHEN QIANHAI RUNWAY TECH CO LTD1SUZHOU SNAIL DIGITAL TECH CO LTD1
Top patents by PatentIndex Score
94 records- 0174US2025125307A1Microelectronic assemblies including interconnects with different solder materialsINTEL CORP·Filed 2024·Application pending·0 cites
- 0272US11837534B2Substrate with variable height conductive and dielectric elementsINTEL CORP·Filed 2017·Granted Dec 5, 2023·2 cites·7 claims
- 0366US12412868B2Microelectronic assemblies including interconnects with different solder materialsINTEL CORP·Filed 2021·Granted Sep 9, 2025·0 cites·20 claims
- 0465USD1012591SCoffee machineNINGBO HAWK ELECTRICAL APPLIANCE CO LTD·Filed 2022·Granted Jan 30, 2024·4 cites·1 claims
- 0561US2025022786A1Methods and apparatus for edge protected glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 0661US2025105074A1Glass cores including protruding through glass vias and related methodsINTEL CORP·Filed 2024·Application pending·0 cites
- 0759US2025391718A1Integrated circuit packages including substrates with reinforced glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 0859US2024105571A1Implantation of species on glass core surface for low loss and high strength applicationsINTEL CORP·Filed 2022·Application pending·0 cites
- 0958US2025218999A1Passive component assembly for thickness modification to match core thicknessINTEL CORP·Filed 2023·Application pending·0 cites
- 1058US2025218998A1Low temperature solder interconnect for package pitch scalingINTEL CORP·Filed 2023·Application pending·0 cites
- 1157US12449600B2Position controlled waveguides and methods of manufacturing the sameINTEL CORP·Filed 2021·Granted Oct 21, 2025·0 cites·25 claims
- 1257US12354883B2Omni directional interconnect with magnetic fillers in mold matrixINTEL CORP·Filed 2021·Granted Jul 8, 2025·0 cites·18 claims
- 1357US2025219028A1Deep trench capacitors in multi-core integrated circuit device package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 1457US2025210426A1Microelectronic assemblies with strengthened glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 1557US2025220818A1Flow enhanced dummy structure to enable capillary flow based sidewall fillingINTEL CORP·Filed 2023·Application pending·0 cites
- 1657US2025218904A1Technologies for power and spacer components embedded in a substrate coreINTEL CORP·Filed 2023·Application pending·0 cites
- 1757US2025218880A1Microelectronic assemblies with pillar-first conductive via formation in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 1857US2025218960A1Methods and apparatus to embed semiconductor devices in cores of package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 1957US2025218926A1Microelectronic assemblies including cavity-less encapsulated diesINTEL CORP·Filed 2023·Application pending·0 cites
- 2056US11923312B2Patternable die attach materials and processes for patterningINTEL CORP·Filed 2019·Granted Mar 5, 2024·0 cites·12 claims
- 2156US2025273607A1Methods and architectures for shallow fiducial and metal defined pad designsINTEL CORP·Filed 2024·Application pending·0 cites
- 2256US2025219021A1Vertically embedded components in package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 2356US2024339381A1Air-gap traces and air-gap embedded bridge integrated in glass interposerINTEL CORP·Filed 2023·Application pending·0 cites
- 2456US2025112085A1Apparatus and methods for capillary underfill of embedded devicesINTEL CORP·Filed 2023·Application pending·0 cites
- 2556US2025183180A1Direct bonding for embedded bridges with viasINTEL CORP·Filed 2023·Application pending·0 cites
- 2656US2025218957A1Methods and apparatus to embed a semiconductor device in a glass coreINTEL CORP·Filed 2023·Application pending·0 cites
- 2755US2025105209A1High performance microelectronic assemblies including through-silicon via bridges with top die first approachINTEL CORP·Filed 2023·Application pending·0 cites
- 2855US2025112165A1Anisotropic conductive connections for interconnect bridges and related methodsINTEL CORP·Filed 2023·Application pending·0 cites
- 2955US2025113434A1Through glass via (tgv) with modulated profile for core stress reductionINTEL CORP·Filed 2023·Application pending·0 cites
- 3055US2025105222A1High performance microelectronic assemblies including through-silicon via bridges with top die last approachINTEL CORP·Filed 2023·Application pending·0 cites
- 3155US2025106983A1Stiffener architectures for glass edge protectionINTEL CORP·Filed 2023·Application pending·0 cites
- 3255US2025192069A1Microelectronic assemblies with pre-singulation edge features in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 3355US2024194548A1Apparatus and method for electroless surface finishing on glassINTEL CORP·Filed 2022·Application pending·0 cites
- 3455US2025112164A1Controlling substrate bump heightINTEL CORP·Filed 2023·Application pending·0 cites
- 3555US2024243087A1Methods and apparatus to reduce variation in height of bumps after reflowINTEL CORP·Filed 2024·Application pending·0 cites
- 3655US2025192070A1Microelectronic assemblies with post-singulation edge features in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 3754US2024222301A1Methods and apparatus for optical thermal treatment in semiconductor packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 3854US2024222136A1Electrical layer with roughened surfacesINTEL CORP·Filed 2022·Application pending·0 cites
- 3954US2024128181A1Package substrate with dual damascene based self-aligned viasINTEL CORP·Filed 2022·Application pending·0 cites
- 4054US2024162157A1Bumpless hybrid organic glass interposerINTEL CORP·Filed 2022·Application pending·0 cites
- 4154US2024312865A1Methods, systems, apparatus, and articles of manufacture to improve reliability of vias in a glass substrate of an integrated circuit packageINTEL CORP·Filed 2023·Application pending·0 cites
- 4254US2024332125A12d fillers for reduced cte for pidINTEL CORP·Filed 2023·Application pending·0 cites
- 4353US2024213116A1Methods, systems, apparatus, and articles of manufacture to cool integrated circuit packages having glass substratesINTEL CORP·Filed 2022·Application pending·0 cites
- 4453US2024213169A1Low die height glass substrate device and methodINTEL CORP·Filed 2022·Application pending·0 cites
- 4553US2024222210A1Glass substrate fabrication using hybrid bondingINTEL CORP·Filed 2022·Application pending·0 cites
- 4653US2024222238A1Apparatus and method for attaching an optical component using no remelt metallurgyINTEL CORP·Filed 2022·Application pending·0 cites
- 4753US2024219660A1Optical semiconductor package and methodINTEL CORP·Filed 2022·Application pending·0 cites
- 4853US2024222345A1Die attach in glass core package through organic-to-organic bondingINTEL CORP·Filed 2022·Application pending·0 cites
- 4953US2024219654A1Optical semiconductor package and methodINTEL CORP·Filed 2022·Application pending·0 cites
- 5053US2024112971A1Singulation of integrated circuit package substrates with glass coresINTEL CORP·Filed 2022·Application pending·0 cites
Showing the top 50 of 94 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →