Inventor · disambiguated record
Han-De Chen
Also filed as: CHEN HAN-DE
14 granted patents·19 pending applications·6 citations·filing 2021–2025
85Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD33
Top patents by PatentIndex Score
33 records- 0196US11908708B2Laser de-bonding carriers and composite carriers thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 20, 2024·3 cites·20 claims
- 0294US11855040B2Ion implantation with annealing for substrate cuttingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·2 cites·20 claims
- 0391US12132079B2Bonding and isolation techniques for stacked transistor structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 29, 2024·1 cites·20 claims
- 0484US2025329576A1Depositing and oxidizing silicon liner for forming isolation regionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0583US12347696B2Laser de-bonding carriers and composite carriers thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 1, 2025·0 cites·20 claims
- 0681US12327811B2Ion implantation with annealing for substrate cuttingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 10, 2025·0 cites·20 claims
- 0780US2025293052A1Laser de-bonding carriers and composite carriers thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0879US2025359312A1Semiconductor device manufacturing on assembled waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0979US2025273624A1Ion implantation with annealing for substrate cuttingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1077US2025349818A1Bonding techniques for stacked transistor structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1177US2024274465A1Depositing and Oxidizing Silicon Liner for Forming Isolation RegionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1277US2025324687A1Channel regions in stacked transistors and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1375US2025323206A1Temperature controllable bonder equipment for substrate bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1474US2024379616A1Dynamic bonding gap control and tool for wafer bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1574US2024387451A1Wafer Bonding Apparatus and MethodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1674US2024387445A1Wafer bonding system and method of using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1773US2024379748A1Bonding and Isolation Techniques for Stacked Transistor StructuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1871US12489082B2Metal nanoparticles in an amorphous bonding layer between a device substrate and carrier substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Dec 2, 2025·0 cites·20 claims
- 1970US12249592B2Dynamic bonding gap control and tool for wafer bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 11, 2025·0 cites·20 claims
- 2070US12230532B2Semiconductor device, method of manufacture by monitoring relative humidity, and system of manufacture thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 18, 2025·0 cites·20 claims
- 2170US2025089313A1Channel regions in stacked transistors and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2270US2024321855A1Bonding techniques for stacked transistor structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2370US2023378001A1Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2469US11996317B2Methods for forming isolation regions by depositing and oxidizing a silicon linerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 28, 2024·0 cites·20 claims
- 2567US12237211B2Bonding system with sealing gasket and method for using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 25, 2025·0 cites·20 claims
- 2667US2024321883A1Semiconductor device manufacturing on assembled waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2766US12255171B2Wafer bonding system and method of using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 18, 2025·0 cites·20 claims
- 2865US12211820B2Wafer bonding apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 28, 2025·0 cites·20 claims
- 2965US2025149378A1Semiconductor Device, Method of Manufacture by Monitoring Relative Humidity, and System of Manufacture ThereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3064US12368129B2Temperature controllable bonder equipment for substrate bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 22, 2025·0 cites·20 claims
- 3162US11842933B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 12, 2023·0 cites·20 claims
- 3258US2024282815A1Bonding and Isolation Techniques for Stacked Transistor StructuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3355US2025006687A1Heat dissipation in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →