Inventor · disambiguated record
Hao-Wei Cheng
Also filed as: CHENG HAO · CHENG HAO-WEI
3 granted patents·7 pending applications·0 citations·filing 2004–2024
44Inventor score
Files withNOVATEK MICROELECTRONICS CORP3TENCENT TECH SHENZHEN CO LTD3LEE CHAO-CHUN2INFOPOWER CORP1INSYDE SOFTWARE CORP1
Top patents by PatentIndex Score
10 records- 0168US12307027B2Stylus control circuit and stylusNOVATEK MICROELECTRONICS CORP·Filed 2023·Granted May 20, 2025·0 cites·8 claims
- 0262US12346507B2Stylus control circuit and stylusNOVATEK MICROELECTRONICS CORP·Filed 2023·Granted Jul 1, 2025·0 cites·8 claims
- 0360US2024005165A1Machine learning model training method, prediction method therefor, apparatus, device, computer-readable storage medium, and computer program productTENCENT TECH SHENZHEN CO LTD·Filed 2023·Application pending·0 cites
- 0460US2024211991A1Data processing method, apparatus, and computer-readable storage mediumTENCENT TECH SHENZHEN CO LTD·Filed 2024·Application pending·0 cites
- 0556US2024177006A1Data processing method and apparatus, program product, computer device, and mediumTENCENT TECH SHENZHEN CO LTD·Filed 2024·Application pending·0 cites
- 0648US2025355673A1Bios setup service method, computer device and non-transitory computer-readable storage mediumINSYDE SOFTWARE CORP·Filed 2024·Application pending·0 cites
- 0744US11822745B2Driving method of active stylus and related driving deviceNOVATEK MICROELECTRONICS CORP·Filed 2022·Granted Nov 21, 2023·0 cites·25 claims
- 0832US2008098298A1Compound Web Document Generation Method and Web-based Editing System for Generating a Compound Web DocumentLEE CHAO-CHUN·Filed 2007·Application pending·0 cites
- 0932US2006106822A1Web-based editing system of compound documents and method thereofLEE CHAO-CHUN·Filed 2004·Application pending·0 cites
- 1028US2006150245A1System and method of automatically transforming instant message transmission modes on internetINFOPOWER CORP·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →