Inventor · disambiguated record
Hangchul Choi
Also filed as: CHOI HANGCHUL
0 granted patents·4 pending applications·0 citations·filing 2024–2024
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0161US2025219001A1Semiconductor package and method for making the sameSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 0261US2025157958A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0358US2025157867A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0457US2025167135A1Semiconductor package including a stiffenerSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →