Inventor · disambiguated record
Hai Ding
Also filed as: DING HAI · DING HAI-PING
7 granted patents·1 pending application·48 citations·filing 2003–2024
81Inventor score
Top patents by PatentIndex Score
8 records- 0178US6953925B2Microlens integrationST MICROELECTRONICS INC·Filed 2003·Granted Oct 11, 2005·28 cites·8 claims
- 0268US7250684B2Circular wire-bond pad, package made therewith, and method of assembling sameINTEL CORP·Filed 2004·Granted Jul 31, 2007·14 cites·4 claims
- 0359US9443801B2Method to reduce metal fuse thickness without extra maskST MICROELECTRONICS INC·Filed 2015·Granted Sep 13, 2016·1 cites·14 claims
- 0452US9059174B2Method to reduce metal fuse thickness without extra maskDING HAI·Filed 2008·Granted Jun 16, 2015·1 cites·6 claims
- 0548US7389013B2Method and system for vertical optical coupling on semiconductor substrateST MICROELECTRONICS INC·Filed 2004·Granted Jun 17, 2008·4 cites·25 claims
- 0647US2008014436A1Circular wire-bond pad, package made therewith, and method of assembling sameINTEL CORP·Filed 2007·Application pending·0 cites
- 0742USD1105549SLampDING HAI·Filed 2024·Granted Dec 9, 2025·0 cites·1 claims
- 0836US10270351B1EMI-radiation suppression circuitASIAN POWER DEVICES INC·Filed 2018·Granted Apr 23, 2019·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →