Inventor · disambiguated record
Hanghang Dong
Also filed as: DONG HANGHANG
1 granted patent·2 pending applications·0 citations·filing 2022–2022
6Inventor score
Technology areasH10W
Files withHONOR DEVICE CO LTD3
Top patents by PatentIndex Score
3 records- 0154US12439555B2Method for manufacturing heat dissipation structure of electronic element, heat dissipation structure, and electronic deviceHONOR DEVICE CO LTD·Filed 2022·Granted Oct 7, 2025·0 cites·20 claims
- 0245US2024363477A1Thermal pad, heat dissipation module, and electronic deviceHONOR DEVICE CO LTD·Filed 2022·Application pending·0 cites
- 0345US2024298424A1Method for Manufacturing Heat Dissipation Structure of Electronic Element, Heat Dissipation Structure, and Electronic DeviceHONOR DEVICE CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →