Inventor · disambiguated record
Hao-Ju Fang
Also filed as: FANG HAO · FANG HAO-JU
9 granted patents·2 pending applications·14 citations·filing 2011–2020
79Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD5FANG HAO-JU2UNIV SOOCHOW2CSMC TECHNOLOGIES FAB1 CO LTD1HSU TSUNG-HSIEN1
Top patents by PatentIndex Score
11 records- 0180US11387053B2Aramid fiber electrode and preparation method thereforUNIV SOOCHOW·Filed 2018·Granted Jul 12, 2022·2 cites·11 claims
- 0280US8766416B2Semiconductor package and fabrication method thereofHSU TSUNG-HSIEN·Filed 2012·Granted Jul 1, 2014·9 cites·9 claims
- 0379US9673151B2Semiconductor package having metal layerSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Jun 6, 2017·3 cites·10 claims
- 0449US11527472B2Electronic package, supporting structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Dec 13, 2022·0 cites·14 claims
- 0549US10074613B2Method of fabricating semiconductor package including cutting encapsulating body and carrier to form packagesSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Sep 11, 2018·0 cites·13 claims
- 0649US9502758B2Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Nov 22, 2016·0 cites·24 claims
- 0745US11942272B2Aramid fiber electrochemical capacitor and preparation method thereforUNIV SOOCHOW·Filed 2018·Granted Mar 26, 2024·0 cites·8 claims
- 0842US9526171B2Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Dec 20, 2016·0 cites·11 claims
- 0937US2012235259A1Semiconductor package and method of fabricating the sameFANG HAO-JU·Filed 2011·Application pending·0 cites
- 1036US9520400B2NOR structure flash memory and manufacturing method thereofCSMC TECHNOLOGIES FAB1 CO LTD·Filed 2013·Granted Dec 13, 2016·0 cites·16 claims
- 1132US2012170162A1Semiconductor package and fabrication method thereofFANG HAO-JU·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →