Inventor · disambiguated record
Hans Hadersbeck
Also filed as: HADERSBECK HANS
9 granted patents·239 citations·filing 1976–1988
90Inventor score
Files withSIEMENS AG9
Top patents by PatentIndex Score
9 records- 0194US4906346AElectroplating apparatus for producing humps on chip componentsSIEMENS AG·Filed 1988·Granted Mar 6, 1990·74 cites·9 claims
- 0282US4652336AMethod of producing copper platforms for integrated circuitsSIEMENS AG·Filed 1985·Granted Mar 24, 1987·66 cites·7 claims
- 0380US4121044AFlexible through-contacted printed circuitsSIEMENS AG·Filed 1976·Granted Oct 17, 1978·41 cites·7 claims
- 0462US4046620AProcess for improving the solderability of electric circuit boardsSIEMENS AG·Filed 1976·Granted Sep 6, 1977·15 cites·8 claims
- 0554US4727012AMethod of manufacture for print heads of ink jet printersSIEMENS AG·Filed 1985·Granted Feb 23, 1988·9 cites·11 claims
- 0646US4481035AChemical gilding bathSIEMENS AG·Filed 1983·Granted Nov 6, 1984·11 cites·8 claims
- 0744US4357647APrinted circiuit boardSIEMENS AG·Filed 1980·Granted Nov 2, 1982·11 cites·2 claims
- 0838US4268349AProcess for the production of printed circuits with solder rejecting sub-zonesSIEMENS AG·Filed 1976·Granted May 19, 1981·6 cites·4 claims
- 0931US4795694AManufacture of fine structures for semiconductor contactingSIEMENS AG·Filed 1987·Granted Jan 3, 1989·6 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →