Inventor · disambiguated record

Harry Hollack

Also filed as: HOLLACK HARRY

3 granted patents·487 citations·filing 1997–2001

81Inventor score

Technology areasG06F

Files withFLIP CHIP TECHNOLOGIES L L C3

Top patents by PatentIndex Score

3 records

0193US6287893B1Method for forming chip scale packageFLIP CHIP TECHNOLOGIES L L C·Filed 1998·Granted Sep 11, 2001·241 cites·2 claims
0291US6441487B2Chip scale package using large ductile solder ballsFLIP CHIP TECHNOLOGIES L L C·Filed 1997·Granted Aug 27, 2002·182 cites·19 claims
0389US6750135B2Method for forming chip scale packageFLIP CHIP TECHNOLOGIES L L C·Filed 2001·Granted Jun 15, 2004·64 cites·13 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →