Inventor · disambiguated record
Harry Kam Cheng Hong
Also filed as: HONG HARRY KAM CHENG
8 granted patents·75 citations·filing 2000–2004
84Inventor score
Technology areasH10W
Files withNAT SEMICONDUCTOR CORP8
Top patents by PatentIndex Score
8 records- 0183US6448107B1Pin indicator for leadless leadframe packagesNAT SEMICONDUCTOR CORP·Filed 2000·Granted Sep 10, 2002·39 cites·16 claims
- 0264US6677667B1Leadless leadframe package design that provides a greater structural integrityNAT SEMICONDUCTOR CORP·Filed 2000·Granted Jan 13, 2004·11 cites·34 claims
- 0364US6629880B1Rotary mechanical buffing method for deflashing of molded integrated circuit packagesNAT SEMICONDUCTOR CORP·Filed 2000·Granted Oct 7, 2003·14 cites·26 claims
- 0462US6576989B1Locking of mold compound to conductive substrate panelsNAT SEMICONDUCTOR CORP·Filed 2000·Granted Jun 10, 2003·10 cites·21 claims
- 0544US6808961B1Locking of mold compound to conductive substrate panelsNAT SEMICONDUCTOR CORP·Filed 2003·Granted Oct 26, 2004·1 cites·24 claims
- 0640US6818970B1Leadless leadframe package design that provides a greater structural integrityNAT SEMICONDUCTOR CORP·Filed 2003·Granted Nov 16, 2004·0 cites·22 claims
- 0738US6963124B1Locking of mold compound to conductive substrate panelsNAT SEMICONDUCTOR CORP·Filed 2004·Granted Nov 8, 2005·0 cites·22 claims
- 0838US6933174B1Leadless leadframe package design that provides a greater structural integrityNAT SEMICONDUCTOR CORP·Filed 2004·Granted Aug 23, 2005·0 cites·27 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →