Inventor · disambiguated record
Hao-Cheng Hou
Also filed as: HOU HAO · HOU HAO-CHENG
35 granted patents·31 pending applications·119 citations·filing 2009–2025
96Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD60LAI CHIH-HUANG1NAT UNIV TSING HUA1NINGBO INSTITUTE OF MATERIALS TECH & ENGINEERING CHINESE ACADEMY OF SCIENCES1TAIWAN SEMICONDUCTOR MANUFACTRING CO LTD1
Top patents by PatentIndex Score
66 records- 0197US11270921B2Semiconductor package including dies having high-modulus dielectric layer and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 8, 2022·6 cites·20 claims
- 0297US11101209B2Redistribution structures in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 24, 2021·20 cites·19 claims
- 0396US11961777B2Package structure comprising buffer layer for reducing thermal stress and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 16, 2024·2 cites·20 claims
- 0496US9564416B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 7, 2017·25 cites·20 claims
- 0595US10026671B2Substrate design for semiconductor packages and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jul 17, 2018·27 cites·20 claims
- 0692US11894341B2Semiconductor package with through vias and stacked redistribution layers and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 6, 2024·2 cites·20 claims
- 0788US11145639B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 12, 2021·5 cites·20 claims
- 0888US11088069B2Semiconductor package and semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·5 cites·20 claims
- 0986US10074604B1Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 11, 2018·5 cites·20 claims
- 1086US9824902B1Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 21, 2017·5 cites·11 claims
- 1185US9691723B2Connector formation methods and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 27, 2017·3 cites·20 claims
- 1283US12506116B2Semiconductor structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 23, 2025·1 cites·20 claims
- 1383US11404342B2Package structure comprising buffer layer for reducing thermal stress and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 2, 2022·2 cites·20 claims
- 1483US2025311102A1Laminated structure with padsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1581US12362321B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 15, 2025·0 cites·20 claims
- 1681US2025309193A1Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1780US10818614B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 27, 2020·2 cites·20 claims
- 1880US2025357303A1Methods of forming a packaging substrate including an underfill injection openingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1979US2025349558A1Redistribution lines and the method forming the same through stitchingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2079US2025349685A1Package structure and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2179US2025351388A1Packages with chips comprising inductor-vias and methods forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2279US2025349684A1Semiconductor Device Packages and Methods of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2377US9859267B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 2, 2018·2 cites·20 claims
- 2477US2025338520A1Package with Integrated Voltage Regulator and Method Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2577US2025349732A1Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2677US2025336901A1Packages including interconnect die embedded in package substratesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2776US9165876B2Package-on-package structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 20, 2015·3 cites·20 claims
- 2876US2025349733A1Three-Dimensional Semiconductor Device and MethodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2975US2025298056A1Substrate structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3075US2024379535A1Semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3175US2022359436A1Connector Formation Methods and Packaged Semiconductor DevicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3274US2024234302A1Semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3373US12418982B2Laminated structure with pads and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 16, 2025·0 cites·20 claims
- 3472US2025323126A1Integrated circuit packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3571US12345740B2Probe card substrate, substrate structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 1, 2025·0 cites·20 claims
- 3671US10504858B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 10, 2019·1 cites·20 claims
- 3770US2024310733A1Redistribution Lines and The Method Forming the Same Through StitchingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3869US12417968B2Package structure and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 16, 2025·0 cites·20 claims
- 3969US2025125224A1Integrated circuit packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4068US7989098B2Perpendicular magnetic recording mediumNAT UNIV TSING HUA·Filed 2009·Granted Aug 2, 2011·2 cites·7 claims
- 4168US2024047509A1Packages with Chips Comprising Inductor-Vias and Methods Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4268US2024055468A1Package with integrated voltage regulator and method forming the sameTAIWAN SEMICONDUCTOR MANUFACTRING CO LTD·Filed 2023·Application pending·0 cites
- 4366US11424199B2Connector formation methods and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 23, 2022·0 cites·20 claims
- 4466US2024038646A1Semiconductor Device Packages and Methods of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 4566US2023307375A1Semiconductor Package and Method of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4665US2023307427A1Packages Including Interconnect Die Embedded in Package SubstratesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 4764US12412846B2Semiconductor package and methods of fabricating a semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 9, 2025·0 cites·20 claims
- 4864US9929115B2Device with optimized thermal characteristicsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 27, 2018·1 cites·20 claims
- 4963US12142560B2Semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 12, 2024·0 cites·20 claims
- 5061US2025266343A1Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
Showing the top 50 of 66 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →