Inventor · disambiguated record
Hau-Yi Hsiao
Also filed as: HSIAO HAU-YI
14 granted patents·12 pending applications·16 citations·filing 2018–2025
87Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD26
Top patents by PatentIndex Score
26 records- 0198US11127635B1Techniques for wafer stack processingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 21, 2021·12 cites·20 claims
- 0284US10504716B2Method for manufacturing semiconductor device and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 10, 2019·3 cites·20 claims
- 0383US2025241053A1Techniques for wafer stack processingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0480US12293946B2Techniques for wafer stack processingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 6, 2025·0 cites·20 claims
- 0579US2025357421A1Support structure to reinforce stacked semiconductor wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0678US2024363613A1Protective wafer grooving structure for wafer thinning and methods of using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0777US12087756B2Protective wafer grooving structure for wafer thinning and methods of using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 10, 2024·0 cites·20 claims
- 0876US11545395B2Techniques for wafer stack processingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 3, 2023·0 cites·20 claims
- 0975US12500093B2Composite particulates for use as part of a supporting fill mixture in a semicondutor substrate stacking applicationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 16, 2025·0 cites·20 claims
- 1074US11087971B2Method for manufacturing semiconductor device and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·1 cites·20 claims
- 1174US2024379468A1Process tool for analyzing bonded workpiece interfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1274US2024379721A1High reflectance isolation structure to increase image sensor performanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1373US2024198455A1Damage prevention during wafer edge trimmingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1472US12237165B2Method for wafer bonding including edge trimmingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 25, 2025·0 cites·20 claims
- 1570US12469817B2Support structure to reinforce stacked semiconductor wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 11, 2025·0 cites·20 claims
- 1670US12278151B2Semiconductor wafer seal ring having protrusion extending into trench in semiconductor substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 15, 2025·0 cites·20 claims
- 1770US11552066B2Protective wafer grooving structure for wafer thinning and methods of using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 10, 2023·0 cites·20 claims
- 1868US2025210427A1Semiconductor wafer seal ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1967US12205855B2Process tool for analyzing bonded workpiece interfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 21, 2025·0 cites·20 claims
- 2067US2024316724A1Multi-pattern in-pad surface for polish rate controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2166US11951569B2Damage prevention during wafer edge trimmingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 9, 2024·0 cites·20 claims
- 2262US12272715B2High reflectance isolation structure to increase image sensor performanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 8, 2025·0 cites·20 claims
- 2361US2025309181A1Fluid dispensing apparatus, wafer bonding apparatus, and method of manufacturing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2461US2025316501A1Method for treating two substrates and semiconductor apparatus for performing the treatmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2557US2024371666A1In-line wafer edge sealing monitoring system and methods of operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2656US2024339422A1Supporting sealant layer structure for stacked die applicationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →