Inventor · disambiguated record
Han-Kun Hsieh
Also filed as: HSIEH HAN-KUN
6 granted patents·48 citations·filing 2001–2003
81Inventor score
Top patents by PatentIndex Score
6 records- 0165US7098126B2Formation of electroplate solder on an organic circuit board for flip chip joints and board to board solder jointsPHOENIX PREC TECHNOLOGY CORP·Filed 2001·Granted Aug 29, 2006·16 cites·10 claims
- 0263US6790758B2Method for fabricating conductive bumps and substrate with metal bumps for flip chip packagingSILICON INTEGRATED SYS CORP·Filed 2002·Granted Sep 14, 2004·12 cites·11 claims
- 0362US6574863B2Thin core substrate for fabricating a build-up circuit boardPHOENIX PREC TECHNOLOGY CORP·Filed 2001·Granted Jun 10, 2003·10 cites·10 claims
- 0452US6864586B2Padless high density circuit boardSILICON INTEGRATED SYS CORP·Filed 2003·Granted Mar 8, 2005·4 cites·19 claims
- 0552US6707677B1Chip-packaging substrate and test method thereforSILICON INTEGRATED SYS CORP·Filed 2003·Granted Mar 16, 2004·3 cites·18 claims
- 0647US6720246B1Flip chip assembly process for forming an underfill encapsulantSILICON INTEGRATED SYS CORP·Filed 2003·Granted Apr 13, 2004·3 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →