Inventor · disambiguated record
Hanqing Hu
Also filed as: HU HANQING
2 granted patents·3 pending applications·2 citations·filing 2017–2018
35Inventor score
Files withCHINA WAFER LEVEL CSP CO LTD5
Top patents by PatentIndex Score
5 records- 0170US10541186B2Chip package and chip packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2018·Granted Jan 21, 2020·2 cites·13 claims
- 0247US10817700B2Optical fingerprint recognition chip package and packaging methodCHINA WAFER LEVEL CSP CO LTD·Filed 2018·Granted Oct 27, 2020·0 cites·20 claims
- 0333US2019013302A1Packaging method and package structure for fingerprint recognition chip and drive chipCHINA WAFER LEVEL CSP CO LTD·Filed 2018·Application pending·0 cites
- 0432US2019296064A1Packaging method and packaging structure for semiconductor chipCHINA WAFER LEVEL CSP CO LTD·Filed 2017·Application pending·0 cites
- 0532US2020395399A1Packaging method and packaging structure for semiconductor chipCHINA WAFER LEVEL CSP CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →